Efficient heat radiation device

A heat dissipation device and high-efficiency technology, which is applied in the direction of instruments, electrical digital data processing, and digital data processing parts, can solve the problems of bulky, expensive, and complex structures, and achieve simple structural design, reduced costs, and improved flexibility Effect

Inactive Publication Date: 2013-04-03
冯进
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Of course, there are also those that use liquid cooling, which requires the establishment of a liquid circulation structure, which is bulky, expensive, and complex in structure

Method used

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Embodiment Construction

[0026] The invention will be further described below in conjunction with the accompanying drawings.

[0027] Such as figure 1 As shown, this high-efficiency heat dissipation device includes a planar heat dissipation substrate 1, and the heat dissipation surface of the heat dissipation substrate is covered with a layer of mesh-shaped hydrophilic layer 2 made of hydrophilic materials, such as mesh Sponge layer, or resin fabric layer, such as a type of foreign fiber represented by COOLMAX, or a material layer similar to polar groups such as hydroxyl, carboxyl, etc. The layer provides a liquid supply device 3 for evaporating liquid, and the liquid supply device 3 is a liquid reservoir, and a liquid outlet hole is provided at the bottom where it contacts the hydrophilic layer.

[0028] Such as figure 2 Shown is the specific embodiment 2 of the invention. The liquid supply device includes a liquid reservoir 30 and an infusion tube 31. One end of the infusion tube communicates wit...

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PUM

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Abstract

The invention discloses an efficient heat radiation device which comprises a heat radiation baseplate, wherein at least one hydrophilic layer is laid on a heat radiation surface of the heat radiation baseplate; and the efficient heat radiation device further comprises a liquid supply device for supplying evaporated liquor to the hydrophilic layer. When the device is in use, the evaporated liquor in the hydrophilic layer is evaporated under high temperature, and then heat on the heat radiation surface of the heat radiation baseplate is taken away under the action of evaporation of the evaporated liquor, so that temperature is lowered quickly, and the temperature difference is improved remarkably; meanwhile, evaporation of the evaporated liquor occurs in the space of the whole heat radiation baseplate, so that airflow produced by evaporation and humidifying of the evaporated liquor is helpful to heat radiation of peripheral devices; and for different heat radiation occasions, the efficient heat radiation device can be additionally provided with various auxiliary devices, such as a liquid homogenizing device, a liquid taking chamber and a liquid taking control device. Based on the conventional efficient heat radiation device, the hydrophilic layer and an infusion tube of the efficient heat radiation device can be slightly improved and can be redesigned and remounted, so that the cost is lower, and the structural design is very simple.

Description

technical field [0001] The invention relates to a high-efficiency heat dissipation technology; in particular, it relates to a high-efficiency heat dissipation device for a high-power device or device. Background technique [0002] The energy consumed by modern industrial equipment is increasing, and the excess heat generated is also increasing. The ensuing heat dissipation is an urgent problem for engineers to solve. Take the computer as an example. Since the computer system is running faster and faster, the heat generated by the computer system will also increase significantly at any time. If the heat generated during the operation of the computer system is not transferred quickly, it will be reduced. The function of the computer system, when it reaches a certain temperature, will cause the computer system to crash or be damaged. Therefore, a high-efficiency cooling device is needed to transfer the heat generated when the computer system is running. A common computer CPU ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 冯进
Owner 冯进
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