High-power light-emitting diode (LED) lamp and packaging method thereof

A technology of LED lamps and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of serious LED light scattering and inconsistent color temperature in space, and achieve the effects of good color temperature consistency, reduced light decay, and uniform thickness

Active Publication Date: 2015-04-01
宁波安芯美半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the defects of traditional LED packaging methods, the purpose of this invention is to propose a high-power LED lamp and its packaging method to solve the problems of serious LED light scattering and inconsistent color temperature in space

Method used

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  • High-power light-emitting diode (LED) lamp and packaging method thereof
  • High-power light-emitting diode (LED) lamp and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] see figure 1 and 2 Shown, a kind of encapsulating method of high-power LED lamp of the present invention, concrete technological process is as follows:

[0029] Step 1: Fix the LED chip 2 to one side of the first substrate 1 with silver glue, then connect the LED chip 2 to the first substrate 1 with a gold wire, and then connect the first substrate 1 with the chip 2 at 40 ℃ heating for 80min, in this embodiment the first substrate 1 is a metal substrate;

[0030] The second step: apply the first transparent sealant 3 on the glass substrate 6 by screen printing to form a first transparent sealant layer with a light transmittance greater than 90%, pre-bake the glass substrate 6 at 80° C. Bake at ℃ for 3 hours to solidify and form a film;

[0031] Step 3: Print the fluorescent powder colloid 4 on the first transparent sealant layer by screen printing to form a fluorescent powder glue layer with a light transmittance greater than 90%, bake the glass substrate 6 at 80°C f...

Embodiment 2

[0035] A kind of encapsulating method of high-power LED lamp of the present invention, concrete technological process is as follows:

[0036] Step 1: Fix the LED chip 2 to one side of the first substrate 1 with a eutectic material, then connect the LED chip 2 to the first substrate 1 with a gold wire, and then connect the first substrate 1 with the chip 2 on the Heating at 40°C for 120 minutes, in this embodiment, the first substrate 1 is a ceramic substrate;

[0037] The second step: apply the first transparent sealant 3 on the glass substrate 6 by screen printing to form a first transparent sealant layer with a light transmittance greater than 90%, pre-bake the glass substrate 6 at 80° C. Bake at ℃ for 3 hours to solidify and form a film;

[0038] Step 3: Print the fluorescent powder colloid 4 on the first transparent sealant layer by screen printing to form a fluorescent powder glue layer with a light transmittance greater than 90%, bake the glass substrate 6 at 80°C for 1...

Embodiment 3

[0042] A kind of encapsulating method of high-power LED lamp of the present invention, concrete technological process is as follows:

[0043] Step 1: Fix the LED chip 2 to one side of the first substrate 1 with silver glue, then connect the LED chip 2 to the first substrate 1 with a gold wire, and then connect the first substrate 1 with the chip 2 at 40 ℃ heating for 100min, in this embodiment the first substrate 1 is a metal substrate;

[0044] The second step: apply the first transparent sealant 3 on the glass substrate 6 by screen printing to form a first transparent sealant layer with a light transmittance greater than 90%, pre-bake the glass substrate 6 at 80° C. Bake at ℃ for 3 hours to solidify and form a film;

[0045]Step 3: Print the fluorescent powder colloid 4 on the first transparent sealant layer by screen printing to form a fluorescent powder glue layer with a light transmittance greater than 90%, bake the glass substrate 6 at 80°C for 1 hour, and cure it into ...

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Abstract

The invention discloses a high-power light-emitting diode (LED) lamp and a packaging method thereof. The high-power LED lamp comprises a first substrate and a glass substrate, wherein an LED chip is fixed on the first substrate, and a first transparent sealant and a fluorescent powder colloid are sequentially coated on the surface of the glass substrate. The edge of the first substrate and the edge of the glass substrate butt through glass cement, wherein glass powder is mixed in the glass cement. The LED chip is packaged between the first substrate and the glass substrate, and a second transparent sealant is filled between the first substrate and the glass substrate. A fluorescent glue layer is achieved through a screen printing mode and is even in thickness, color temperature uniformity of a light source space can be achieved well through control of properties, thickness and evenness of the fluorescent glue layer, and a second sealing transparent glue layer is filled between the fluorescent glue layer and the first substrate so as to prevent the fluorescent powder from being contacted with the LED chip with high heat, and therefore reliability of a product is improved, and luminous decay is reduced.

Description

technical field [0001] The invention belongs to the field of LED lamps, and in particular relates to a high-power LED lamp and a packaging method thereof. Background technique [0002] In recent years, LED has attracted much attention due to its advantages of high light efficiency, energy saving, environmental protection, high safety, and long life. It is widely used in various lighting and backlight module fields, and its advantages as a new generation of light source are very obvious. [0003] The traditional method is to mix the phosphor powder and epoxy resin evenly and directly coat it on the chip. Since the light conversion is realized in the phosphor powder coating, the energy loss during the conversion process from blue light to yellow light is converted into heat, which affects the luminous efficiency of the chip. , At the same time, the increase in temperature causes the luminous wavelength of the phosphor to drift, which affects the light color. In addition, sinc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/56H01L33/50
Inventor 赵莉
Owner 宁波安芯美半导体有限公司
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