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Processing substrates with temporary carriers

A technology for processing substrates and substrates, applied in the direction of layered product processing, transistors, electrical solid devices, etc., can solve problems such as misalignment of electronic components, and achieve the effect of avoiding deformation and damage

Active Publication Date: 2016-06-29
弗莱克英纳宝技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One challenge in fabricating such devices is preventing misalignment of electronic components caused by deformation of the substrate during processing

Method used

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  • Processing substrates with temporary carriers
  • Processing substrates with temporary carriers
  • Processing substrates with temporary carriers

Examples

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Embodiment Construction

[0028] According to the first embodiment of the present invention, as figure 1 As shown, multiple flexible device substrates 8 ( figure 1 Only one shown in ) is fixed to the rigid glass carrier 1 via adhesive elements 6 . As will be discussed in more detail below, electronic components 10 , such as an array of TFTs, are formed on the device substrate 8 after the device substrate 8 has been secured to the rigid glass carrier 1 . After processing, the device substrate 8 is removed from the carrier 1 . The electronic component 10 is formed on the device substrate 8 via a planarization layer 9 which is deposited on the device substrate 8 after fixing the device substrate 8 to the carrier 1 .

[0029] Processing of a device substrate includes a sequence of steps including deposition of material and removal of the deposited material. Such deposition and removal steps are automatically controlled based on the intended position and configuration of the device substrate 8 on the car...

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Abstract

A technique comprising: securing a device substrate (8) to a carrier (1) by means of one or more adhesive elements (6); forming electrons on the device substrate when the device substrate is thus secured to the carrier element (10); and thereafter reducing the adhesive strength of at least one of the one or more adhesive elements to facilitate release of the substrate from the carrier.

Description

technical field [0001] The present invention relates to methods of processing substrates. In one embodiment, it is directed to a method of processing a flexible substrate in the manufacture of flexible electronic devices. Background technique [0002] Some electronic devices such as flexible displays use flexible polymer substrates as supports for electronic components such as TFT arrays. [0003] One challenge in fabricating such devices is preventing misalignment of electronic components caused by deformation of the substrate during processing. One technique aimed at reducing this misalignment is to subject the plastic (polymer) substrate to a prolonged bake prior to processing. SUMMARY OF THE INVENTION [0004] The present invention aims to provide an improved technique for reducing this misalignment. [0005] The invention provides a method comprising: securing a device substrate to a carrier with one or more adhesive elements; forming an electronic component on the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L29/786
CPCH01L21/6835H01L29/78603H01L2221/6835H01L2221/68381H01L27/1266Y02E10/549H01L2221/68318Y02P70/50H01L21/673H10K71/80H10K77/111H01L21/68H01L21/20H01L21/78H01L21/02H01L21/304H01L23/12H01L21/67H01L21/70H01L21/50H01L23/32B32B2307/748B32B37/12B32B7/06B32B2309/02H05K13/00
Inventor J·瓦特
Owner 弗莱克英纳宝技术有限公司