Thermal resistance composition test device and method for LED (light emitting diode) lamp

Abstract

The invention relates to a thermal resistance composition test device and a thermal resistance composition method for an LED (light emitting diode) lamp, and belongs to the technical field of semiconductor LED illumination and display reliability design and checking. The device and the method provided by the invention have the main invention points that in the actual LED lamp, partial LEDs are selected and isolated to be used as temperature measuring elements, synchronous switching modes and devices for controlling an external lamp power supply are designed, the transient state temperature rise process curve collection line and methods are utilized, and the real thermal resistance composition of the LED lamp is measured on line. When the LED lamp adopts different heat radiators or the contact between the heat radiator and an LED device is poor, the heat resistance of each part is different, the heat radiation design of the LED lamp can be optimized through measuring the thermal resistance composition in different designs and equipment, the highest junction temperature of the lamp is reduced, and the service life and the quality of the LED lamp are ensured. The device and the method provided by the invention are mainly used for fast determining the thermal resistance composition of the LED lamp in a nondestructive way.

Description

Technical field: [0001] This technology belongs to the field of semiconductor LED lighting and display reliability design and assessment technology. The invention is mainly applied to a method and device for quickly and non-destructively determining the thermal resistance of LED lamps. Background technique: [0002] Semiconductor LED lighting fixtures or display panels use a certain number of power LED devices as light sources, which will generate a lot of heat during operation, which will increase the temperature at the semiconductor PN junction and reduce performance. Generally, a heat sink or an additional heat sink is used to conduct heat from the concentrated area of ​​the LED chip to the external environment to ensure that the junction temperature is lower than the safe temperature and ensure the quality of the entire lamp. [0003] However, the prior art can only measure the thermal resistance of a single LED chip, but cannot measure the thermal resistance of the lamp. The ...

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Problems solved by technology

[0003] However, in the prior art, only the thermal resistance of a single LED chip can be measured, but the thermal resistance of the assembled lamp cannot be measured. The common method is to measure the temperature at the surface of the LED lamp through the temperature measuring probe on the surface

This is extremely inconvenient for the design and application of actual LED lamps

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