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Dustproof film assembly receiving container

A technology for dust-proof film components and storage containers, which is applied to instruments, electrical components, and originals for opto-mechanical processing, etc., can solve problems such as difficulty, poor reliability, and dust hazards, and achieve less risk of foreign matter adhesion and simplicity. Structure, the effect of preventing falling off

Active Publication Date: 2013-05-08
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the needle is fixed by a combination device such as a screw, the needle can be fixed securely, but there is a risk of dust generation.
In addition, when the needle is roughly tapered and fixed by friction force, it is difficult to adjust the friction force to an appropriate level, and the reliability is poor.

Method used

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  • Dustproof film assembly receiving container
  • Dustproof film assembly receiving container
  • Dustproof film assembly receiving container

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Hereinafter, examples of the present invention will be described in detail, but the scope of the present invention is not limited by these examples.

Embodiment 1)

[0060] Manufactured by vacuum forming with antistatic ABS resin sheet figure 1 The container body 12 and the cover body 14 of the shown shape. The container body 12 and the cover body 14 are fitted and locked at the peripheral edge to form a figure 1 The pellicle storage container 10 is shown. Openings 14 a are formed at four places near corners in the longitudinal direction of the cover body 14 . The size of the dust-proof film assembly storage container 10 is 1005×937 mm in shape and 70 mm in height. The sheets used for molding are transparent 5 mm for the lid body 14 and black 5 mm for the container body 12

[0061] Further, by injection molding, with ABS resin, the Figure 5 represents the needle mounting part 32 and is prepared with PPS resin, Figure 4 Pin 28 shown. The needle 28 is formed by a front end portion 28a, a middle portion 28b, and a rear end portion 28c. Between the middle portion 28b and the rear end portion 28c, a protrusion 30 constituting a holding ...

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Abstract

A dustproof film assembly receiving container is provided. A dustproof assembly is fixed at a specific position of a container body and is covered by a cover for preventing alien objects adsorbing on the assembly, and can be firmly maintained during transportation in a fixed state or can be simply removed in the fixed state. The dustproof film assembly receiving container consists of the container body on which the dustproof film assembly (16) is loaded and the cover (14), and is provided with multiple dustproof film assembly fixing portions (18), Each fixing portion (18) comprises a recess (26) of a dustproof film assembly framework (16a), a needle (28) which has a front end portion (28a) that may rotate in an inserted state, a needle mounting portion (32) which is disposed in the container body (12) and may install the needle (28) by extracting the front end portion (28a) from the recess (26) of the dustproof film assembly framework (16a), an opening portion (14a) of the cover (14) which may rotate the needle (28) in the needle mounting portion (32) from an outer side of the cover body (14a) that is installed in the container body (12), and a blocking plate (40) of the opening portion (14a). The needle mounting portion (32) has a protrusion portion (30) and a notch portion (32b) that when the mounted needle (28) rotates in a specific angle the needle (28) is maintained.

Description

technical field [0001] The present invention relates to storing a pellicle in a pellicle container in which a pellicle is attached to a pellicle frame and is used in the manufacture of semiconductor components, printed circuit boards, or liquid crystal display devices. Background technique [0002] In the manufacture of semiconductors such as LSI and super LSI, and the manufacture of liquid crystal display devices, etc., photolithography is performed to create a pattern by irradiating a semiconductor wafer or an original plate for liquid crystal with light. At this time, if dust adheres to the photomask or reticle, the dust absorbs the light and bends the light, thereby deforming the transferred pattern, causing uneven edges, and blackening of the base. . The above work is usually performed in a clean room. Even so, it is difficult to keep the photomask clean all the time. Therefore, a pellicle in which a transparent pellicle is attached to a pellicle frame is used. In thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D75/28B65D75/52
CPCG03F1/66H01L21/0273H01L21/6735
Inventor 关原一敏
Owner SHIN ETSU CHEM IND CO LTD