Automatic height measuring device of splitting machine and height measuring method thereof

Abstract

The present invention provides an automatic height measuring device of a splitting machine and a height measuring method thereof. The automatic height measuring device comprises the following components: a base, a movable platform, a linear displacement device, a splitting knife and a base platform. The movable platform is equipped on the base movably in a vertical direction. The linear displacement device controls movement of the movable platform. The splitting knife is equipped on the movable platform. The base platform is equipped below the splitting knife. A linear conder is equipped on the base of the splitting machine along the movement path of the movable platform. A position feedback device is equipped on the movable platform of the splitting machine and senses the linear conder for generating a number. A control system senses variation value of the current or voltage of the linear displacement device of the splitting machine and records the number which is generated by the position feedback device. The automatic height measuring device of the splitting machine can measure thickness of a target object through the linear displacement device and the movable platform of the splitting machine and causes the position feedback device and the linear coder to record the current position, thereby easily and quickly measuring the thickness of the target object and furthermore improving operation efficiency.

Description

technical field [0001] The invention relates to an automatic height measuring device of a splitting machine and a height measuring method thereof. Background technique [0002] A splitting machine generally refers to a machine that applies pressure to an object with a splitting knife and splits it. It includes a knife and a plurality of transmission mechanisms, wherein the knife includes a base and a splitting knife. When in use, place the object to be split on the base, and then make the active end of the splitting knife go down to the object Apply pressure and thereby split. [0003] However, the existing splitting machines are mostly used for very precise items, such as wafers, etc., so their movements are required to be quite precise, even the up and down feed distance of the splitting knife is the same; however, under high-precision inspection Under the circumstances, the thickness of each target is not necessarily the same, or even the same target has a slight differ...

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Problems solved by technology

[0003] However, the existing splitting machines are mostly used for very precise items, such as wafers, etc., so their movements are required to be quite precise, even the up and down feed distance of the splitting knife is the same; however, under high-precision inspection Under the circumstances, the thickness of each target is not necessarily the same, or even the same target has a slight difference in thickness due to its uneven surface, and these factors will affect the cutting stroke of the splitting knife , if the cleaving knife goes too deep, it may split to other places that should not be split, or if the cleaving knife is too shallow, it will not be able to completely split the target

[0004] Therefore, in order to solve the cutting problem of the splitting knife, before each cutting, there will be personnel to manually measure the thickness of the target object. No matter which method is used, it will cause trouble for the operator and greatly affect the work efficiency; especially when it is used for wafers, it may be necessary to split more than ten times or even dozens of times, and each It is necessary to measure the thickness of the place again before each split, which will greatly lengthen the working time

[0005] Therefore, the measurement method that cannot quickly and accurately measure the thickness of the target object needs to be improved.

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