Unlock instant, AI-driven research and patent intelligence for your innovation.

Lighting apparatus having improved light output uniformity and thermal dissipation

A technology for light-emitting devices and packages, applied in lighting devices, independent lighting devices, lighting and heating equipment, etc., can solve problems such as output light uniformity or heat dissipation that is not optimized.

Active Publication Date: 2013-05-15
EPISTAR CORP
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional optics designs are not optimized for output light uniformity or heat dissipation
[0004] Therefore, although the existing LED manufacturing method can generally meet its planned purpose, it is not satisfactory in all aspects.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lighting apparatus having improved light output uniformity and thermal dissipation
  • Lighting apparatus having improved light output uniformity and thermal dissipation
  • Lighting apparatus having improved light output uniformity and thermal dissipation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051]It is to be understood that the following disclosure provides many different embodiments or examples for implementing different features of the present invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to limit the invention. For example, in the following description, forming a first component on or over a second component may include embodiments in which the first component and the second component are in direct contact, and may also include that other components may be formed between the first component and the second component. An embodiment in which the space between the first part and the second part is not in direct contact. Also, the terms "top," "bottom," "below," "above," etc. are used for convenience and are not intended to limit the scope of the embodiments to any particular orientation. Various features may also be arbitrarily drawn in d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup. The invention further provides a lighting apparatus having improved light output uniformity and thermal dissipation.

Description

technical field [0001] The present invention relates generally to light emitting devices, and more particularly to a light emitting device using one or more semiconductor optical devices as a light source. Background technique [0002] In recent years, the semiconductor integrated circuit (IC) industry has experienced rapid development. Technological developments in IC materials and designs have produced many types of ICs for different purposes. One of these ICs includes optical devices, such as light emitting diode (LED) devices. As used herein, an LED device is a semiconductor light source for generating light at a specific wavelength or range of wavelengths. LED devices are traditionally used for indicator lights and increasingly for displays. LED devices emit light when a voltage is applied across a p-n junction formed by oppositely doping semiconductor compound layers. Different wavelengths of light can be generated using different materials by changing the bandgap ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V7/10F21V5/08F21V13/02F21V29/00F21Y101/02
CPCF21S2/00F21V29/00F21V7/10F21V5/08F21V13/02F21S6/00F21V17/12F21V29/763F21K9/62F21Y2115/10F21V29/50F21V29/70
Inventor 柯佩雯叶伟毓
Owner EPISTAR CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com