Unlock instant, AI-driven research and patent intelligence for your innovation.

Light emitting element, backlight module, liquid crystal display device and lighting equipment

A technology of light-emitting components and backlight modules, which is applied in the directions of electrical components, optics, nonlinear optics, etc., can solve the problems of expensive materials and LED heat dissipation problems that have not been effectively solved, so as to improve the heat dissipation effect, prolong the service life, The effect of lowering the junction temperature

Active Publication Date: 2016-03-30
BEIJING BOE OPTOELECTRONCIS TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inventor found in the process of realizing the present invention that the commonly used heat dissipation method is generally to use a substrate with good heat dissipation, and the material cost of the substrate with good heat dissipation is usually relatively expensive, so the heat dissipation problem of LEDs has not been effectively solved.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting element, backlight module, liquid crystal display device and lighting equipment
  • Light emitting element, backlight module, liquid crystal display device and lighting equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] An embodiment of the present invention provides a light-emitting element, such as figure 1 As shown, the light-emitting element includes a printed circuit board 1 and a chip 2 disposed on the first surface of the printed circuit board 1, and also includes:

[0030] A first package body 3 and a second package body 4, the first package body 3 covers the chip 2, and the second package body 4 covers the second surface of the printed circuit board 1 or the printed circuit board 1 part of the second surface of the first packaging body 3 respectively extend a first pipe 5 and a second pipe 6, and the first pipe 5 and the second pipe 6 are respectively connected to the first Two places of the second package body 4, the first package body 3, the first pipeline 5, the second package body 4 and the second pipeline 6 are packaged with a fluid body;

[0031] Wherein, the wafer 2 is energized to generate heat, so that the fluid is heated, and in the first package body 3, the first p...

Embodiment 2

[0037] On the basis of Embodiment 1, this embodiment of the present invention provides a light-emitting element, in which the fluid includes phosphor powder and a heat-conducting liquid, and the phosphor powder is uniformly dispersed in the heat-conducting liquid to ensure This ensures that the density of the fluorescent powder in the fluid near the wafer 2 of the light-emitting element is relatively stable during the circulating flow of the fluid, which ensures the stability of the color of the light emitted by the light-emitting element.

[0038] Further, in order to prevent the flow of the fluid from causing abrasion to the wafer 2 , the surface of the wafer 2 may be coated with a transparent protective layer that does not affect light output from the wafer 2 .

[0039] like figure 2 As shown, in order to make the fluid always flow in one direction in the light-emitting element, generally, the light-emitting element can also include a one-way valve 7 arranged on the first ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A light emitting element comprises: a printed circuit board, a chip disposed on a first face of the printed circuit board, a first encapsulation body and a second encapsulation body. The first encapsulation body covers the chip, and the second encapsulation body covers a second face of the printed circuit board or a part of the second face of the printed circuit board. A first pipe and a second pipe are extended respectively from two positions of the first encapsulation body and are respectively connected to two positions of the second encapsulation body. Fluid is encapsulated within the first encapsulation body, the first pipe, the second encapsulation body and the second pipe.

Description

technical field [0001] The invention relates to the field of liquid crystal display, in particular to a light-emitting element and lighting equipment. Background technique [0002] The core of the light-emitting diode (LightEmittingDiode, referred to as LED) is a semiconductor wafer. The semiconductor wafer is composed of two parts, one is a P-type semiconductor, in which holes dominate, and the other is an N-type semiconductor. The concentration of electrons here is much higher than the concentration of holes. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When the current acts on the chip through the wire, the electrons will be pushed to the region of the P-type semiconductor, and in the region of the P-type semiconductor, the electrons from the N-type semiconductor will recombine with the holes in the P-type semiconductor, and then Energy is emitted in the form of photons. [0003] If the heat dissipation problem o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13357
CPCH01L33/648H01L33/501
Inventor 苏跃峰孙海威李敬石
Owner BEIJING BOE OPTOELECTRONCIS TECH CO LTD