Semiconductor device having lid structure and method of making same

Abstract

A semiconductor device includes a substrate, a first die attached to the substrate, and a lid coupled to the substrate. The lid defines a cavity for engaging the first die, and the lid has a die enclosure barrier having ends extending downwardly into the cavity. The ends of the die enclosure barrier are attached to the substrate and a thermal interface material is disposed between the first die and the lid, thermally connecting the first die to the lid.

Description

technical field [0001] The present invention relates generally to semiconductor devices, and more particularly, to semiconductor packages for semiconductor devices. Background technique [0002] Today, semiconductor devices typically include: a die, a substrate, a heat sink, a thermal interface material (TIM) for connecting the die to the heat sink, one or more metallization layers, input / output (I / O) pins or ball and optional heat sink. The die has source circuit devices and is typically mounted on a substrate or within a cavity in the substrate. Since the active side of the die faces down, such semiconductor devices are often referred to as "flip-chip" packages. [0003] In modern semiconductor packages, the relentless pursuit of higher performance and smaller size has resulted in higher operating frequencies and ever-increasing packing densities (more transistors per unit area). During operation, the circuits on such a die consume a large amount of electrical energy, w...

AI Technical Summary

Problems solved by technology

However, along with heat generation, the die may also work in a high humidity operating environment

Higher levels of moisture can enter the semiconductor package and adversely affect the performance of the die

As moisture ingresses and operating temperatures increase, the TIM's ability to dissipate heat may decrease, reducing die performance and / or causing it to fail

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