Semiconductor device having lid structure and method of making same

Abstract

A semiconductor device includes a substrate, a first die attached to the substrate, and a lid coupled to the substrate. The lid defines a cavity for engaging the first die, and the lid has a die enclosure barrier having ends extending downwardly into the cavity. The ends of the die enclosure barrier are attached to the substrate and a thermal interface material is disposed between the first die and the lid, thermally connecting the first die to the lid.

Description

technical field [0001] The present invention relates generally to semiconductor devices, and more particularly, to semiconductor packages for semiconductor devices. Background technique [0002] Today, semiconductor devices typically include: a die, a substrate, a heat sink, a thermal interface material (TIM) for connecting the die to the heat sink, one or more metallization layers, input / output (I / O) pins or ball and optional heat sink. The die has source circuit devices and is typically mounted on a substrate or within a cavity in the substrate. Since the active side of the die faces down, such semiconductor devices are often referred to as "flip-chip" packages. [0003] In modern semiconductor packages, the relentless pursuit of higher performance and smaller size has resulted in higher operating frequencies and ever-increasing packing densities (more transistors per unit area). During operation, the circuits on such a die consume a large amount of electrical energy, w...

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Problems solved by technology

However, along with heat generation, the die may also work in a high humidity operating environment

Higher levels of moisture can enter the semiconductor package and adversely affec...

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