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Chemical machinery polishing method capable of reducing residual slurry

A chemical machinery and slurry technology, applied in grinding/polishing equipment, grinding/polishing safety devices, grinding machine tools, etc., can solve the problems of reduced service life, time-consuming and laborious, and more residual slurry on the wafer surface.

Active Publication Date: 2013-06-05
CSMC TECH FAB2 CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the effect of scouring is often unsatisfactory, which leads to more residual slurry on the wafer surface, which affects the yield of products
In this regard, measures such as replacing consumables or regularly cleaning the polishing machine are often adopted, but these methods are time-consuming and laborious, and also increase manufacturing costs
Another method is to adjust the chemical flow rate of the cleaning machine, reduce the gap between the cleaning brush and the wafer surface, etc., but frequent adjustment of the flow meter will reduce its service life, and the effect of reducing the cleaning brush gap is not good. obvious

Method used

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  • Chemical machinery polishing method capable of reducing residual slurry
  • Chemical machinery polishing method capable of reducing residual slurry
  • Chemical machinery polishing method capable of reducing residual slurry

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Embodiment Construction

[0019] The present invention is illustrated below by describing specific embodiments of the present invention with reference to the accompanying drawings. However, it should be understood that these specific embodiments are only exemplary, and have no limiting effect on the spirit and protection scope of the present invention.

[0020] In this specification, terms such as "comprising" and "comprising" mean that in addition to the units and steps that are directly and explicitly stated in the specification and claims, the technical solution of the present invention does not exclude The situation of other units and steps clearly stated. Furthermore, the term "wafer" herein generally refers to a circular single crystal semiconductor substrate on which integrated circuits are formed.

[0021] figure 1 A schematic diagram of a typical polishing apparatus 10 for a chemical mechanical polishing process is shown. The apparatus 10 includes a polishing head 110 carrying a wafer 20 (w...

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Abstract

The invention relates to a semiconductor manufacturing process, in particular to a method capable of effectively reducing residual abradant introduced in the process of chemical machinery polish. The chemical machinery polishing method comprises the following steps of grinding and washing, wherein the surface of a wafer is grinned with slurry, the surface of the wafer is washed with fluid to remove residual slurry on the surface, and the slurry is delivered to the surface of the wafer in the washing step.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a method capable of effectively reducing abrasive residues introduced during chemical mechanical polishing. Background technique [0002] During the wafer manufacturing process, the surface needs to be polished in order to obtain a flat surface. Chemical mechanical polishing is a common polishing process that uses abrasives (typically comprising silicon or aluminum oxide particles dispersed in a chemical solvent) to remove unevenness from the wafer surface. During polishing, the wafer is set on the grinding disc of the polishing machine, the abrasive is delivered to the surface of the wafer, and the grinding head uses the abrasive to grind the surface of the wafer to obtain a flat surface. After finishing the polishing, the surface of the wafer is flushed with a fluid (such as deionized water) to remove residual slurry and the like. [0003] However, the flushing effect ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04
CPCB24B37/02B24B55/12
Inventor 杨贵璞曾明范怡平黄勇
Owner CSMC TECH FAB2 CO LTD