Anodizing apparatus, an anodizing system having the same, and a semiconductor wafer

Abstract

An anodizing apparatus for causing an anodizing reaction to substrates immersed in an electrolyte solution. The apparatus includes a storage tank for storing the electrolyte solution, a holder for holding a plurality of substrates in liquid-tight contact with circumferential surfaces of the substrates, a moving mechanism for moving the holder between a transfer position outside the storage tank and a treating position inside the storage tank, and a closing device disposed in the storage tank for cooperating with the holder to complete a liquid-tight closure of the circumferential surfaces of the substrates held by the holder. Chemical reaction treatment is carried out with the circumferential surfaces of the substrates placed in a liquid-tight state. After the chemical reaction treatment is completed, the closing device is made inoperative and the holder is moved away from the treating position to unload the substrates from the storage tank.

Description

technical field [0001] The present invention relates to a substrate for semiconductor wafers, liquid crystal display substrates, plasma display substrates, organic EL device substrates, FED (Field Emission Display: field emission display) substrates, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. , substrates for photomasks, substrates for solar cells, substrates for micro-electromechanical systems (MEMS: Micro-electro-mechanical system), semiconductor wafers for three-dimensional integrated circuits, substrates for optoelectronic integrated circuits, substrates for bioengineering, substrates for medical applications, An anodizing device for performing electrolytic etching on various substrates such as optical waveguide substrates and artificial photosynthesis substrates, an anodizing system having the anodizing device, and a semiconductor wafer, and particularly relates to a simultaneous A technique for batch processing of multiple sub...

AI Technical Summary

Problems solved by technology

Therefore, the same as the first device, there is a problem that it cannot be automated

In addition, although an embodiment of processing two substrates S is disclosed, since the substrate holding member 15 is a structure having a considerable thickness, there is a problem that it is not suitable for batch processing of processing more substrates S.

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