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Encapsulation method for semiconductor laser array

A packaging method and semiconductor technology, applied in the direction of semiconductor lasers, lasers, laser components, etc., can solve the problems of high power density waste heat, limit the application and operation reliability of semiconductor lasers, etc.

Inactive Publication Date: 2013-06-12
INST OF APPLIED ELECTRONICS CHINA ACAD OF ENG PHYSICS
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Problems solved by technology

At present, most of the packaging methods used in high-power DL packages use cooling water and micro-channel micro-channel coolers to solve the problem of high power density waste heat, but generally speaking, there is an electrical connection between cooling water and DL chips in the packaging structure, so in practice Ultrapure water with a resistivity higher than 10 megohms must be used in the application. This harsh requirement greatly limits the application and operational reliability of semiconductor lasers, which is the deficiency of the existing technology

Method used

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  • Encapsulation method for semiconductor laser array

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Embodiment Construction

[0019] In order to clearly illustrate the technical characteristics of this solution, the following describes this solution through a specific implementation mode combined with its accompanying drawings.

[0020] It can be seen from the attached drawings that the packaging method of the semiconductor laser line array of this scheme is as follows:

[0021] a. Fabrication of insulating films on microchannel coolers;

[0022] b. Prepare solder on the insulating film;

[0023] c. Fixing the semiconductor chip and the microchannel cooler using a jig assembly;

[0024] d. welding the semiconductor chip on the insulating film;

[0025] e. Pressure welding electrode leads.

[0026] Wherein the thickness of the insulating film is 1nm-500nm; the insulating film is a metal oxide film.

[0027] The fixture in step c includes a press block, a bead and a base; the weight of the bead is 5-500 grams; the size of the bead is equal to the size of the semiconductor chip, the thickness of the...

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Abstract

The invention provides a technical scheme of an encapsulation method for a semiconductor laser array. The technical scheme includes that an insulation film is prepared on a microchannel cooler to realize water electricity separation, the requirement on the cooling water is reduced, the requirement on the resistivity of the cooling water can be reduced, common cooling water can be used, the environmental adaptability of a laser can be improved favorably, and the service life of the laser is prolonged favorably.

Description

technical field [0001] The present invention relates to a packaging method for semiconductor devices, especially a packaging method for semiconductor laser bar arrays. Background technique [0002] In the prior art, the well-known technology is diode-pumped solid-state laser (DPL), which has many advantages such as high efficiency, long life, good beam quality, small size, light weight, and full curing. It has been developed rapidly in recent years, and It has become the most interesting research hotspot in the laser field in the world today. High-power and high-energy DPL technology has broad application prospects and development potential in industrial processing, medical and military fields. As the core component of high-power DPL - high-power diode laser (DL), its technical level and research and development capabilities directly restrict the development of DPL technology. In recent years, the substantial increase in the output power level of DPL and the huge developme...

Claims

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Application Information

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IPC IPC(8): H01S5/022H01S5/024
Inventor 高松信
Owner INST OF APPLIED ELECTRONICS CHINA ACAD OF ENG PHYSICS
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