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Production process of high-heat-dissipation ceramic substrate circuit board

A technology of ceramic substrate and production process, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of high junction temperature, poor heat conduction effect, uneven heat dissipation, etc., and achieve simple production process, uniform heat dissipation and long service life long effect

Active Publication Date: 2013-06-12
福建鑫禹电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In modern LED lighting equipment, the temperature of the lamp directly affects the service life of the equipment. In order to solve the heat dissipation problem of the light source, the heat transfer method of the light source is usually: the heat-generating device is conducted to the radiator through the aluminum substrate, and then conducted to the air by the radiator. Complete heat conduction, because the light source needs to conduct heat through a layer of material, and the heat conduction effect is poor. During the assembly process of the product, partial assembly is prone to cause uneven heat dissipation, resulting in high local junction temperature and shortening the life of lighting equipment.

Method used

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specific Embodiment approach

[0016] A production process for a high heat dissipation ceramic base circuit board, comprising the following steps: a. Printing silver paste: brushing silver paste on the ceramic base circuit board to make the silver paste form a circuit circuit shape; b. drying: drying the printed silver paste Put the ceramic substrate circuit board into the drying box, and take it out after sintering at 800°C for 1 hour; c. Configuration solution: After configuring stannous sulfate and sulfuric acid at a ratio of 100:25, put it into the electroplating tank, and the electroplating tank Keep the constant temperature at 25°C; d. Barrel plating: put the ceramic base circuit board sintered in step b into the barrel plating tank, and then put the barrel plating tank into the electroplating tank; e. Access anode tin: put the barrel-plated ceramic The base circuit board is connected to the anode tin made of pure tin plate with a purity of 99.9%; f. Cleaning: put the ceramic base circuit board treated...

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Abstract

The invention discloses a production process of a high-heat-dissipation ceramic substrate circuit board. The production process comprises the following steps of: a, printing silver paste; b, drying; c, preparing solution; d, performing barrel plating; e, connecting anode tin; f, cleaning; g, passivating; and h, feeding solder. The production process has the characteristics of simplicity and uniform product heat dissipation.

Description

technical field [0001] The invention relates to the field of circuit board production technology, in particular to a production technology of a circuit board with a high heat dissipation ceramic substrate. Background technique [0002] In modern LED lighting equipment, the temperature of the lamp directly affects the service life of the equipment. In order to solve the heat dissipation problem of the light source, the heat transfer method of the light source is usually: the heat-generating device is conducted to the radiator through the aluminum substrate, and then conducted to the air by the radiator. To complete the heat conduction, because the light source needs to conduct heat through a layer of material, the heat conduction effect is poor. During the assembly process of the product, partial assembly is prone to cause uneven heat dissipation, resulting in high local junction temperature and shortening the life of lighting equipment. Contents of the invention [0003] T...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/12
Inventor 吴巧斌
Owner 福建鑫禹电子有限公司