Sensor element, method of making the same, and sensor device including the same
A technology of sensor element and conductive member, applied in the field of sensor element and its preparation and sensor device including the sensor element, can solve the problem of limited exposed surface of PIM layer and the like
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[0115] All parts, percentages, ratios, etc. in the examples, as well as in the remainder of this specification, are by weight unless otherwise indicated. Solvents and other reagents used were purchased from Sigma-Aldrich Chemical Company, Milwaukee, WI, USA unless expressly stated otherwise.
[0116] As used hereinafter, the small area bottom electrode is equivalent to the first conductive electrode, the small area top electrode is equivalent to the second conductive electrode; the small area top connection electrode is equivalent to the second conductive member; and the first conductive member is equivalent to the spring-loaded contact pin , which is used to electrically connect the sensor to the operating circuit.
[0117] Material
[0118]
[0119]
[0120] Preparation of PIM
[0121] 5,5',6,6'-tetrahydroxy-3,3 , 3′,3′-Tetramethyl-1,1′-spirobisindene and tetrafluoroterephthalonitrile to prepare PIM materials.
[0122] 5,5',6,6'-tetrahydroxy-3,3,3',3'-tetrameth...
example 3-8 and comparative example G-H
[0175] Sensor elements were prepared as described in Example 1 and stored prior to testing. The description of the sensor elements is recorded in Table 12. After dicing the sample into separate sensor elements, test for short circuits and measure reference capacitance using a Protec multimeter. The reference capacitance of the sensor element samples according to Examples 3 and 4 was about 1.5 nF. The reference capacitance of the sensor element samples according to Example 5 and Comparative Example G was about 1.7 nF, and one sample according to Comparative Example G was short-circuited. The baseline capacitance of the sensor element samples according to Examples 6-8 and Comparative Example H was about 1.6 nF, except that some samples of Examples 6 and 8 and Comparative Example H were shorted.
[0176] Table 12
[0177]
[0178] According to Example 1, the response of the sensor element to MEK vapor was tested. Before the steam test, the sensor element was not heated. ...
example 9-12 and comparative example I-J
[0190] The sensor element was prepared as described in Example 1 and stored prior to testing, except by thermally evaporating 10.0 nm of titanium at a rate of 0.1 nm / sec followed by Figure 5 The mask shown deposits 100.0 nm of nickel at 0.5 nm / sec to deposit the top connection electrode.
[0191] The description of the sensor elements is recorded in Table 16. After dicing the sample into separate sensor elements, test for short circuits and measure reference capacitance using a Protec multimeter. Comparative Examples I-J were not shorted, but were not used as capacitors. The reference capacitance of Example 9 was about 1 nF, and one replica was shorted. The reference capacitance for Examples 10-11 is about 1.7nF.
[0192] Table 16
[0193]
[0194] The sensor element was tested for response to MEK vapor as in Example 1. The sensor element is not heated prior to the steam test. The initial capacitance and dissipation factor were recorded after the sensor element was...
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