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Substrate gap supporter and method for manufacturing same

A manufacturing method and substrate technology, which are applied in the directions of printed circuit manufacturing, support insulator, support structure installation, etc., can solve the problems of uneven spacing, multiple gap brackets not protruding to a predetermined height, unreasonable installation cost and time, etc. Achieving the effect of compact size, suitable for mass production process

Active Publication Date: 2013-06-19
金在玖 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, the conventional gap bracket (10) requires the operator to manually insert one by one into the holes of the PCB substrate (10) for installation, so the installation cost and time are very unreasonable.
In addition, due to the way of inserting the holes by manual work, the plurality of gap brackets (10) cannot all protrude to a predetermined height, and there are some height differences, and there is a problem that the distance between the PCB substrate (10) and the panel is not constant

Method used

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  • Substrate gap supporter and method for manufacturing same
  • Substrate gap supporter and method for manufacturing same
  • Substrate gap supporter and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Figure 5 As a drawing for explaining the space bracket (30) of the first embodiment of the present invention, Figure 5 a is a stereogram, Figure 5 b is along Figure 5 A vertical section of line A-A' of a, Figure 5 c is a side view for illustrating the installation of the gap bracket (30) on the PCB substrate (210).

[0055] Such as Figure 5 a to Figure 5 As shown in c, the gap bracket (30) of the present invention has a hexahedron-shaped main body (31) made of an insulator such as epoxy resin or plastics, and metal foils are attached and installed on the two sides facing each other of the main body (31). (32a, 32b). The metal foils (32a, 32b) are installed on the lower parts of the sides of the main body (31), so that the upper parts of the main body (31) are exposed and the lower parts are covered.

[0056] A through hole (through hole) is formed on the main body (31) so that the two sides for the metal foil (32a, 32b) to be installed penetrate through, a...

Embodiment 2

[0073] Figure 10 It is a drawing for explaining the gap holder (30) of the second embodiment of the present invention. Such as Figure 10 As shown, the second embodiment has the same Figure 7 The same structure, but characterized in that when the gap bracket (30) is installed on the PCB substrate (210), the side (B) and apex (A) on the upper side are chamfered and inclined. This is because if Figure 5 When the gap support (30) is installed as shown in c, the panel (80) may be deeply sunken or torn and damaged by the edges and apexes forming the angle of the gap support (30). This is to prevent this phenomenon.

[0074] Figure 9 as used to illustrate manufacturing Figure 10 The accompanying drawings of the method of the gap bracket (30), although after the Figure 8 The same steps, but characterized in that there are Figure 9 The step of forming V-groove lines (55) and chamfered holes (56) shown in b.

[0075] Specifically, along the center of the stripe (50), a V...

Embodiment 3

[0078] Figure 12 It is a drawing for explaining the gap holder (30) of the third embodiment of the present invention. Such as Figure 12 As shown, the gap bracket (30) of the third embodiment is characterized in that a metal foil (31b) is attached and installed on the bottom surface of the hexahedron-shaped main body (31), and the position where the metal foil (31b) is located is secured by an adhesive ( 140) etc. are attached and installed on the PCB substrate (210). When the gap bracket (30) is attached to the PCB substrate (210), the side (B) and apex (A) on the upper side are chamfered and inclined. Such a chamfer does not have to be formed, but it is preferably present in order to prevent damage to the panel (80) as described above.

[0079] Figure 11 Made as Instructions Figure 12 The accompanying drawings of the method of the clearance bracket (30), such as Figure 11 As shown in a, the metal foil (320b) is only formed on one side of the insulating plate (310),...

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Abstract

The substrate gap supporter (30) according to one embodiment of the present invention comprises a body (31) having a hexahedron shape and made of an insulator, metal foils (32a) and (32b) installed on opposite side surfaces of the body (31) to expose the upper portions of both side surfaces and cover the lower portions of both side surfaces, and a substrate (210) attached to the bottom surface of the body (31). According to the present invention, the gap supporter can be made through an automated process, thus precisely controlling size. Since the gap supporter is attached to the surface of the substrate, there is little possibility for a height difference to occur. And also, because the gap supporter can be installed in an automated process, it is suitable for a mass production process.

Description

technical field [0001] The present invention relates to a substrate gap bracket (also known as: substrate bracket), in particular to a kind of attachment and installation on the substrate, which does not require the operator to manually insert the holes of the substrate one by one. On the substrate, the gap between the substrate and other panels is maintained with a predetermined substrate gap bracket. In addition, the present invention also relates to a manufacturing method suitable for manufacturing the substrate gap holder. Background technique [0002] Flat panel displays (FPDs) such as LCDs, LEDs, PDPs, etc. have been commercialized. As flat panel display devices become thinner, LCD panels, etc., and PCB boards on which drive circuits for driving them are mounted are placed close to each other. Therefore, the PCB board is pressed against the LCD panels, etc., causing a problem of electrical short circuit. In addition, since the height of the electronic components or s...

Claims

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Application Information

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IPC IPC(8): G09F9/00H05K7/14
CPCH05K1/02H05K3/3442H05K2201/10204H05K2201/2036G02F1/13452Y10T29/49227Y10T428/24488Y10T428/31678H01B19/00Y10T29/303H05K3/0017H05K3/42B81C2203/054C23F1/02C23F1/18H01B17/14H05K1/115
Inventor 金在玖
Owner 金在玖