Adhesive film bonding equipment and adhesive film bonding method

Abstract

The present invention provides adhesive film bonding equipment and an adhesive film bonding method using the same, used for bonding an adhesive film to a circuit board. The adhesive film bonding equipment comprises a conveying unit, a cut-off tool, a rotary headstock, and a hot-press headstock; wherein the conveying unit is used for conveying the adhesive film, the cut-off tool is arranged at a periphery of the conveying unit and used for cutting off the adhesive film through repeated movement; the rotary headstock comprises at least one suction hole, the suction hole is arranged at a side edge of the rotary headstock, the rotary headstock enables the suction hole to be selectively adjacent to the periphery of the circuit board and the cut-off adhesive film; the hot-press headstocknis arranged at the periphery of the circuit board, when the suction hole is arranged at the periphery of the circuit board, the hot-press headstock heats the adhesive film. When the circuit board is produced and assembled, mechanical bonding strength between a hot melting film and the circuit board or other electronic component can be enhanced, so as to overcome easy dropping and stripping conditions of the hot melting film, thus the adhesive film bonding equipment is very practical.

Description

technical field [0001] The present invention relates to a device and a method for laminating an adhesive film to a circuit board, in particular to an adhesive film laminating device and a method for laminating an adhesive film automatically. Background technique [0002] With the rapid development of science and technology, people's use of electronic and information products is becoming more and more common and more frequent. With the advancement of technology in the electronics industry, the software and hardware functions that people need are getting stronger and stronger; however, the accompanying bottlenecks in the assembly of electronic components and the mechanical bonding strength between multiple electronic components have not been completely overcome by people. . [0003] For example, when the circuit board is coupled with other electronic components (such as liquid crystal panels, solar panels, etc.), it is often necessary to use a hot melt film (Hot Melt Film, HM...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a film bonding equipment and film bonding method, which can strengthen the bonding mechanical strength of the hot-melt film when producing and assembling circuit boards, so as to overcome the easy falling off of the circuit board and the hot-melt film , the problem of stripping

Images