A kind of low-melting-point metal-water-based conductive composite slurry and preparation method thereof

A low-melting-point metal and composite slurry technology, which is applied to conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problems of poor conductivity of composite slurry, organic carrier volatilization damage, and easy Oxidation and other problems, to achieve the effect of lowering the sintering temperature, improving the overall performance, and simplifying the preparation process
CN110189849BActive Publication Date: 2020-06-19扬州虹运电子材料有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
扬州虹运电子材料有限公司
Publication Date
2020-06-19

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Abstract

The invention discloses low-melting-point metal-CNTS / Cu water-based conductive composite slurry. The low-melting-point metal-CNTS / Cu water-based conductive composite slurry comprises the following components in percentage by mass: 50-80% of a mixed conductive phase, 5-15% of tin powder or bismuth powder, 15-30% of a water-based carrier, 0.1-0.5% of an additive P and 0.1-4.5% of an additive Ga, wherein the total amount is 100%. The present invention further discloses a preparation method of low-melting-point metal-CNTS / Cu water-based conductive composite slurry. In the product and the preparation method thereof, the mixed conductive phase is prepared by employing a chemical plating method, so that the combination of the copper and a carbon nano tube is more compact and uniform; the low-melting-point metal tin or bismuth is used as a new bonding phase, so that the sintering temperature can be reduced, and the comprehensive performance of the slurry is improved; and the water-based carrier is environment-friendly, so that the cost is obviously reduced.
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Description

technical field

[0001] The invention belongs to the technical field of composite electronic paste, and specifically relates to a low-melting-point metal-CNTS / Cu water-based conductive composite paste, and the invention also relates to a preparation method of the low-melting-point metal-CNTS / Cu water-based conductive composite paste . Background technique

[0002] Electronic paste is the basic material for manufacturing electronic components. It is a paste uniformly mixed with solid powder and organic solvent. As a kind of thick film paste, it is an important part of electronic information materials. As a high-tech electronic functional material integrating metallurgy, chemical industry and electronic technology, it is widely used in thick film integrated circuits, electronic surface packaging, microelectronics Electronics industries such as technology, solar cells, printing and high-resolution electrical conductors. With the unprecedented popularization of electronic equip...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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