A kind of preparation method of initial composite billet for non-magnetic Cu-based composite base tape

A technology of composite ingot and composite base tape, which is applied in the field of preparation of initial composite ingot, can solve the problems of a large number of holes, can not meet the application of YBCO high temperature coated conductor strip, complex preparation process, etc.

Inactive Publication Date: 2015-08-05
HENAN NORMAL UNIV
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Problems solved by technology

The baseband preparation technology is the key to the RABiTS technology. Pure nickel Ni is easy to form a strong cubic texture, but pure nickel Ni has ferromagnetism and low yield strength, which cannot meet the application of YBCO high-temperature coated conductor strips. Later, people To solve the above problems through the idea of ​​solute solid solution, Chinese patent CN1408889A (publication date 2003.4.9) discloses adding nickel Ni element with a weight percentage of less than 40% to copper Cu to prepare a non-magnetic Cu-Ni alloy substrate
Since the yield strength of the single-layer non-magnetic Cu-Ni alloy base strip is not very high, it can only meet the partial application of high-temperature coated conductors. ) discloses a layered non-magnetic copper Cu-based alloy composite substrate. Compared with the single-layer substrate, the mechanical strength of the composite substrate is significantly improved, but the raw material of the outer layer is mixed powder, and there are a large amount of The holes and other defects are not conducive to the preparation of the subsequent transition layer and superconducting layer, and the raw material of the outer layer is a composite ingot obtained by sintering mixed powder, which needs to be homogenized and annealed at high temperature for a long time. The preparation process is more complicated, and the outer layer The copper-Cu-based alloy composite base strip prepared from smelted Cu-Ni alloy ingot as the initial raw material and Ni-W mixed powder as the core layer can not only improve the mechanical strength of the copper-Cu-based alloy base strip, but also the initial raw material of the outer layer is smelted ingot. The surface defect of the composite baseband is less than that of the baseband prepared from Cu-Ni mixed powder as the initial raw material of the outer layer, which is more conducive to the subsequent preparation of high-quality transition layer and superconducting layer

Method used

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  • A kind of preparation method of initial composite billet for non-magnetic Cu-based composite base tape
  • A kind of preparation method of initial composite billet for non-magnetic Cu-based composite base tape
  • A kind of preparation method of initial composite billet for non-magnetic Cu-based composite base tape

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Experimental program
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Effect test

Embodiment 1

[0018] The Cu-Ni alloy obtained by vacuum induction smelting with a nickel-Ni atomic percentage of 45% is subjected to high-temperature forging and wire cutting, and the obtained billet is subjected to surface sandblasting treatment (code A) as the outer layer of the composite billet. The sand material is quartz sand, and the particle size of the sand material is 1mm~1.5mm; the Ni-W mixed powder (code-named powder B) obtained by high-energy ball milling with an atomic percentage of tungsten W of 9.5% is used as the core layer. The Cu-Ni alloy after sandblasting and the ball-milled Ni-W powder are layered and placed in the mold in the order of ABA. Using spark plasma sintering technology, the mold filled with ABA is placed in the sintering equipment, and pressure sintering is performed under vacuum conditions. The sintering temperature is 750°C and the time is 8 minutes. The sintered composite billet is hot rolled , The hot rolling temperature is 900℃ and the holding time is 2h,...

Embodiment 2

[0020] The Cu-Ni alloy with 43% Ni by weight obtained by vacuum induction melting is subjected to high temperature forging and wire cutting, and the obtained billet is subjected to surface sandblasting treatment (code named A) as the outer layer of the composite billet. The sand material is quartz sand, and the particle size of the sand material is 1mm~1.5mm; the Ni-W mixed powder (code-named powder B) obtained by high-energy ball milling with an atomic percentage of tungsten W of 9.5% is used as the core layer. The Cu-Ni alloy after sandblasting and the ball-milled Ni-W powder are layered and placed in the mold in the order of ABA. Using spark plasma sintering technology, the mold filled with ABA is placed in the sintering equipment, and pressure sintering is carried out under vacuum conditions. The sintering temperature is 800°C and the time is 5min. The composite billet obtained by sintering is hot rolled. The hot rolling temperature is 900℃ and the holding time is 2h. The d...

Embodiment 3

[0022] The Cu-Ni alloy with 42% Ni by weight obtained by vacuum induction melting is subjected to high temperature forging and wire cutting, and the obtained billet is subjected to surface sandblasting treatment (code named A) as the outer layer of the composite billet. The sand material is quartz sand with a particle size of 1mm~1.5mm; the Ni-W mixed powder (code-named powder B) obtained by high-energy ball milling with an atomic percentage of tungsten W of 9.5% is used as the core layer. The sand-treated Cu-Ni alloy and the ball-milled Ni-W mixed powder are layered in the mold in the order of ABA. Using spark plasma sintering technology, the mold filled with ABA is placed in the sintering equipment, and sintered while pressing under vacuum conditions. The sintering temperature is 800℃ and the time is 5min. The composite billet obtained by sintering is hot rolled. , The hot rolling temperature is 900℃ and the holding time is 2h, the deformation of the first pass of hot rolling...

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Abstract

The invention discloses a preparation method of a composite billet for a Cu-based alloy composite baseband. According to the Cu-based alloy initial composite billet provided by the invention, the surface layer is made of Cu-Ni alloy in which the atomic percent of Ni is 40-46% and the core layer is made of Ni-W alloy in which atomic percent of W is 9-10%. The preparation method of the Cu-based alloy initial composite billet comprises the following steps of: sand blasting the surface of the Cu-Ni alloy (marked with A) of which the atomic percent of Ni is 40-46%, wherein the Cu-Ni alloy is prepared by means of melting; placing the sand-blasted Cu-Ni alloy and the Ni-W mixed powder (marked with B) in which the atomic percent of W is 9-10% in a mold according to the sequence of A-B-A, simultaneously pressing and sintering the Cu-Ni alloy and the Ni-W mixed powder by means of discharge plasma sintering technology to obtain the composite billet, and hot pressing the composite billet to obtain the initial composite billet with large deformation before cold rolling, wherein the deformation of the first pass is 30-40%, the deformation of each subsequent pass is 3-5%, and the total deformation is 50-60%. The initial composite billet is good in interfacial bonding and can be applied to preparation of the initial billet for high-temperature coating superconductive enhanced ductile basebands.

Description

Technical field [0001] The invention relates to a preparation method of an initial composite billet for a non-magnetic high-strength copper-Cu-based alloy composite base tape, which belongs to the technical field of high-temperature coated superconductor textured metal base tapes. Background technique [0002] With the improvement of the performance of high-temperature superconducting materials and the continuous progress of refrigeration technology, high-temperature superconducting technology will increasingly be applied to various fields of social life, such as electricity, transportation, transportation, magnet technology, military technology and so on. In 1996, Amit Goyal and others of the Oak Ridge National Laboratory in the United States obtained a metal base tape with a sharp biaxial texture through a process of large deformation rolling and recrystallization annealing, and then obtained the metal substrate by layer-by-layer epitaxial growth on the metal substrate. Oriente...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22F1/08
Inventor 刘志勇杨炳方刘海瑞尚淑英安义鹏
Owner HENAN NORMAL UNIV
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