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Encapsulation whole process visual monitoring method

A whole-process, visual technology, applied in the direction of semiconductor/solid-state device testing/measurement, etc., can solve the problems of discarded finished products, increase of finished product scrapping rate, limited control effect of finished product scrapping rate, etc., so as to achieve comprehensive monitoring of scrapping rate and quality. Effect

Active Publication Date: 2015-12-02
SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the quality of each material cannot be monitored during the packaging process, the packaged finished product can only be discarded as a waste product during the final test
If the quality of a batch of materials is very poor, and there is no corresponding quality control in the packaging process, the scrap rate of the final product will increase, which will undoubtedly increase the cost of production
[0004] Now there are some monitoring technologies, but these technologies mainly monitor the materials on a single station, and specifically only monitor the quality of the wafer. For the quality monitoring of materials on other stations or the materials in the whole process, It is difficult to achieve, so the control effect on the scrap rate of finished products is relatively limited

Method used

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  • Encapsulation whole process visual monitoring method
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  • Encapsulation whole process visual monitoring method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] In this embodiment, the packaging of sensors is taken as an example for introduction. combine figure 1 , figure 2 As shown, the encapsulation whole process visual monitoring method in this embodiment includes the following steps:

[0037] 1) Three camera mechanisms 5 are installed on the three packaging stations of the packaging equipment, and the three camera mechanisms 5 are then electrically connected to an industrial computer 7. The electrical connection can be connected through USB lines, communication lines, etc. Three light sources 6 are also arranged corresponding to the three camera mechanisms 5;

[0038] 2) Set a template picture without defects in the industrial computer 7 for comparison with the actual picture;

[0039] 3) The light source 6 shines on the materials on the station, and the camera mechanism 5 takes pictures of the materials on the station, and the images obtained from the photos are input into the industrial computer 7 and compared with th...

Embodiment 2

[0059] This embodiment is introduced by taking the packaging process of diodes as an example. It is roughly the same as the content of embodiment 1, the difference is: as image 3 , Figure 4 As shown, it also includes a second dispensing mechanism 9 for dispensing glue to the chip, which constitutes a fourth station 13, which is arranged between the second station and the third station. This fourth station 13 is also equipped with a camera mechanism 5 and a light source 6 . An alarm module 8 may also be included.

[0060] When monitoring the above-mentioned fourth station 13:

[0061] 2) In the step, a picture of a material that has been dispensed with glue on the grain without defects is set in the industrial computer 7;

[0062] In step 3), the camera mechanism takes pictures of the material pictures on the third station 14, and the images obtained from the pictures are input into the industrial computer for comparison with the predetermined material pictures.

[0063]...

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Abstract

The invention discloses a vision monitoring method for a full encapsulation process. The vision monitoring method comprises the following steps of: 1) arranging a plurality of photographing mechanisms at a plurality of stations for encapsulation of encapsulation equipment, wherein a plurality of photographing mechanisms are electrically connected with an industrial control computer, and a plurality of light sources are correspondingly arranged on a plurality of photographing mechanisms; 2) setting a template picture without any defect in the industrial control computer, and comparing the template picture with an actual picture; and 3) irradiating materials at the stations by the light sources, photographing the materials at the stations by the photographing mechanisms, inputting images obtained by photographing into the industrial control computer, comparing the images with the set template picture, and if the images are different from the template picture, indicating that the materials are defected, otherwise, indicating that the materials are not defected. By the vision monitoring method, the materials can be fully monitored during encapsulation of a semiconductor device, so that the rejection rate can be effectively controlled.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a visual monitoring method for the whole packaging process. Background technique [0002] The packaging process of semiconductor devices mainly includes the step of attaching the die to the substrate, so the quality of the die and the substrate also directly affects the quality of the finished product. [0003] In order to improve the quality of the finished product, the quality control of the die and the substrate has also become an important step in the packaging operation process, wherein the quality of the die depends on the quality of the wafer. Therefore, if the quality of each material cannot be monitored during the packaging process, the packaged finished product can only be discarded as a waste product during the final test. If the quality of a batch of materials is very poor, and the corresponding quality control is not carried out during the packaging ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
Inventor 王敕
Owner SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD