Method for detecting interlayer adhesion and method for making test piece

Abstract

The present invention provides a method for detecting interlayer adhesion force based on the four-point bending method and a method for manufacturing a detection test piece. The detection method comprises: providing the to-be-detected test piece, which is formed with a first dielectric film and a second dielectric film in order; forming a first groove on the second dielectric film till the surface of the first dielectric film; filling metal in the first groove, and flattening the metal surface with the second dielectric film by a chemical machinery planarization; growing oxide film on the second dielectric film and forming a second groove on the oxide film at a position corresponding to the first groove, wherein the depth of the second groove is no bigger than the thickness of the oxide film; bonding the oxide film with the substrate, and forming an open groove on the substrate at a position corresponding to the first groove and the second groove to form the detection test piece; and using the four-point bending method to test the adhesion force between the first dielectric film and the second dielectric film.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for detecting interlayer adhesion and a method for making a test piece. Background technique [0002] In the semiconductor manufacturing process, it is often necessary to form multilayer films, and it is required to ensure that the adhesion between the films (ie, interlayer adhesion) reaches the desired target to ensure the reliability and durability of the device. [0003] Parameters affecting the adhesion between films include the materials used and various process conditions. In order to make the adhesion meet the requirements, it is necessary to make a test piece containing at least two layers of the film to be tested, detect its adhesion by a certain method, and optimize the parameters according to the test results to achieve the final goal. These parameters and materials can then be applied to the actual process to ensure the quality of the fin...

AI Technical Summary

Problems solved by technology

However, in the actual testing process, some problems often occur

For example, if the applied force 130 is too small, the silicon substrate 105 can only be broken, or the epoxy resin 104 can only be delaminated from its upper and lower layers, but not enough to cause delamination between the first film 101 and the second film 102. (because the adhesion force of the latter is greater than the former); if the force 130 is slightly larger, it may cause the silicon substrate 100 to break

These situations will lead to inaccurate determination of the adhesion force between films and lead to low reproducibility of test results

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