Fixture for clamping and corroding wafer
A wafer and fixture technology, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as inability to monitor in real time, lack of clamping wafers, and inability to monitor wafer breakdown characteristic curves, so as to prevent corrosion Effect
Active Publication Date: 2013-07-03
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS
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Problems solved by technology
[0004] The above-mentioned Hfe control process is relatively long, and parameters such as VCBO, VCEO, and VFBE cannot be monitored in real time during the production process, and the breakdown characteristic curve of the wafer cannot be monitored, and software breakdown, pipeline breakdown, etc. cannot be detected in time bad
However, if a test wafer is to be used for scale-up testing during the wafer preparation process (such as testing the wafer in a specific tuned Hfe scale-up control step), there is a lack of equipment to hold the wafer for testing
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[0023] Further illustrate the present invention below in conjunction with accompanying drawing. Those skilled in the art can understand that the following is only to describe the gist of the present invention in conjunction with specific embodiments, and does not limit the implementation of the present invention. The scope of the present invention is determined by the appended claims, and any modifications and changes that do not deviate from the spirit of the present invention shall be covered by the claims of the present invention.
[0024] Fig. 1 is a schematic structural diagram of an example of a clamp according to the present invention. The jig is used for clamping the wafer to etch it during the semiconductor wafer manufacturing process. As shown in the figure, the jig 1 includes a first clamping part 10 and a second clamping part 20 . The first clamping part 10 and the second clamping part 20 are pivotally connected together through the connecting part 12 , so...
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The invention provides a fixture for clamping a wafer. The fixture for clamping and corroding the wafer in the process of manufacturing of a semiconductor wafer comprises a first clamping piece and a second clamping piece, wherein the second clamping piece is connected with the first clamping piece in a pivot mode, a first hole portion is arranged in the first clamping piece, and a first sealing piece is arranged around the first hole portion. After the first clamping piece and the second clamping piece are pressed, the first hole portion forms a first channel which is used for corroding the wafer clamped between the first clamping piece and the second clamping piece, and the first sealing piece isolates a wafer area to be corroded from other areas. The fixture for clamping and corroding the wafer can clamp and corrode the wafer in the process of preparation of the wafer so that working procedures such as amplification and testing can be carried out.
Description
technical field [0001] The invention relates to semiconductor device manufacturing, in particular to a clamping device capable of clamping wafers in the semiconductor manufacturing process. Background technique [0002] The manufacturing process of semiconductor devices includes a series of inspection processes to judge whether the chips formed on the wafer are good or not. Hfe (Hybrid Forward Common Emitter) test is an important part of the inspection process. The essence of the Hfe test is to test the current magnification of the triode. [0003] As we all know, in the production process of power transistors, Hfe control, VCBO, VCEO and VFBE monitoring are extremely important and have certain difficulties, among which Hfe control is the most difficult. It is basically difficult to measure and control Hfe in real time during the fabrication of power transistors. The current method is to test Hfe after the power transistors are fabricated. Here, a brief descri...
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IPC IPC(8): H01L21/683
Inventor 张广冰袁敏杰姚承锡季勇
Owner WUXI CHINA RESOURCES HUAJING MICROELECTRONICS