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LED packaging structure

A technology of LED packaging and packaging board, applied in the field of lighting, can solve the problems of insufficient sealing of chips, unreasonable design, short service life, etc., and achieve the effect of long service life, not easy to glare, and simple and reasonable design

Inactive Publication Date: 2013-07-31
HANGZHOU LONGSHANG PHOTOELECTRIC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The above scheme has improved the problem of uneven illumination of the existing LED street lamps to a certain extent, making it have the advantages of high brightness and concentrated light emission, but the scheme still exists: the traditional metal heat dissipation structure is still used, the design is not reasonable enough, and the chip Insufficient sealing, poor waterproof, easy to produce glare, poor heat dissipation, high cost, poor insulation, short service life and other problems

Method used

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Embodiment Construction

[0020] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] like figure 1 and 2 As shown, the LED packaging structure includes a heat dissipation substrate 1, on which a printed circuit 2 is arranged, and the printed circuit 2 is connected to a plurality of P-N junctions 21 arranged on the heat dissipation substrate 1, and the heat dissipation substrate 1 is located at the P-N junction 21 One side is provided with a light-emitting structure 3 that can emit light under the excitation of the light source of the P-N junction 21. The heat dissipation substrate 1 is made of a non-metallic material and a number of heat dissipation through holes 11 are arranged on the heat dissipation substrate 1, so that it has low cost and is insulated. Good performance and good heat dissipation.

[0022] As a preferred solution, in order to improve the light transmittance of the light source and effective...

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Abstract

The invention belongs to the technical field of illumination, and particularly relates to an LED (light-emitting diode) packaging structure. The LED packaging structure solves the problems that the existing LED packaging structure is poor in heat dissipation, and glare appears easily during the illumination. The LED packaging structure comprises a heat dissipation substrate, wherein a printed circuit is arranged on the heat dissipation substrate, and connected with a plurality of P-N knots arranged on the heat dissipation substrate, and a light-emitting structure capable of emitting light under light source excitation action of the P-N knots is arranged on one side, positioned at the P-N knots, of the heat dissipation substrate. The LED packaging structure is characterized in that the heat dissipation substrate is made of a non-metal material, and a plurality of heat dissipation through holes are formed in the heat dissipation substrate. Compared with the prior art, the LED packaging structure has the advantages that the LED packaging structure is simple and reasonable in design, high in sealability, good in weather resistance, high in water resistance, good in heat dissipation, low in cost, good in insulativity and long in service life, and does not generate the glare easily, and a light source is concentrated and uniform.

Description

technical field [0001] The invention belongs to the technical field of lighting, and in particular relates to an LED packaging structure. Background technique [0002] With the continuous improvement of LED luminous efficiency and reliability and the continuous reduction of production costs, the use of LEDs for road lighting has become a technical development trend in the lighting field. Although the photopic luminous effect of white LEDs is still lower than that of high-pressure sodium lamps, it helps to improve the visual sensitivity of drivers and pedestrians due to its high color rendering, does not use harmful substances such as mercury, and has a wide operating temperature range. It can avoid normal use in severe cold areas and wide spectrum, and can reasonably adjust its spectral energy distribution. It is expected to obtain higher luminous efficiency than high-pressure sodium lamps in the state of intermediate vision, and because of the good orientation of LED light ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
Inventor 洪志荣
Owner HANGZHOU LONGSHANG PHOTOELECTRIC