Embedded integrated intelligent die

Abstract

The invention discloses an embedded integrated intelligent die which comprises an upper die set plate, an upper die fixing plate, a guide pillar, a core die, a discharging plate, a lower die set plate and a cavity die. The cavity die is arranged on the lower die set plate; the upper die fixing plate is provided with the core die which is matched with the cavity die; the upper die fixing plate is arranged on the upper die set plate; the core die is arranged on the upper die set plate; the guide pillar which penetrates through the discharging plate to be fixed on the upper die set plate enters into the cavity die to guide and correct under the working state of the embedded integrated intelligent die; an elastic device is arranged between the discharging plate and a core die fixing plate; the discharging plate can move up and down along the guide pillar; and the upper die set plate, the cavity die and the lower die set plate are respectively provided with a sensor. Accordingly, the embedded integrated intelligent die has the advantages of being capable of utilizing the sensors which are embedded in the embedded integrated intelligent die to integratedly obtain various information on the embedded integrated intelligent die to adjust technical parameters when the embedded integrated intelligent die works, guaranteeing that die machining is under real-time monitoring and accurate machining conditions, reducing defective products and reducing the rate of the detective products by 20%, improving the working efficiency and being capable of reducing debugging time of the embedded integrated intelligent die by 50%.

Description

technical field [0001] The invention relates to the field of industrial automation control, in particular to an embedded integrated intelligent mold. Background technique [0002] At present, due to the rapid development of my country's modernization construction, the production of various products is increasingly dependent on molds. It is an important tool to improve production efficiency and realize standardized production. Molds are widely used in mass production of today's products. In the prior art, after the mold is installed on the punching machine, various technical parameters of the mold (such as closed height, pressure, temperature, etc.) need to be obtained through the adjustment of the punching machine, etc. Once the conditions of the punching machine change, it is necessary to repeatedly debug the various technologies of the mold At the same time, the statistics of die punching times can only be obtained through the accumulation of punching times of the punchin...

AI Technical Summary

Problems solved by technology

[0003] After long-term practical analysis of the existing molds for the production of stamping parts and sheet metal parts, it is found that the molds in the prior art have the following shortcomings: 1. After the mold is installed on the punching machine, after the closing height adjustment is completed, its height can only be determined by the scale of the punching machine display, but due to the low precision of the punch scale, it is impossible to accurately display the real closed height of the mold. In the secondary production, only by adjusting the height of the punch, the closed height of the mold cannot be adjusted quickly and accurately, and there is a problem of repeated adjustment of the mold

At the same time, due to the differences between different punching machines, the height of the punching machine measured on one punching machine cannot be completely suitable for other punching machines, and there is a problem of repeated adjustment of the mold

2. For the punching times of the mold, it can only be continuously accumulated through the punching times of the punching machine, and the punching times of the mold cannot be quickly and conveniently known

3. For the mold production, the temperature of the mold punch and the die cannot be obtained in time and conveniently

4. The speed, acceleration and pressure suitable for punching products cannot be obtained directly

Chinese patent CN 200610155246.1 discloses an embedded closed-loop control mold protection system. The system installs a sensor on the detected part of the mold, and the signal acquisition device collects the signal sent by the sensor and feeds it back to the control device, thereby realizing the protection of the mold. However, the present invention does not Sensor types and specific functions of undisclosed molds

[0005] In summary, although it is seen in the prior art that the mold is controlled by designing a sensor in the mold, a single sensor is usually set in the mold to control a single variable of the mold. It is common to set a temperature sensor in the mold, but it is not seen in the mold. Displacement sensors, acceleration sensors, pressure sensors, etc. are set in the mold, and there is no comprehensive setting of multiple sensors on the mold to comprehensively control and obtain various experimental parameters in mold production

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