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Measuring method for junction temperature of LED (light emitting diode)

A technology of light-emitting diodes and measurement methods, applied in the direction of measuring devices, measuring heat, thermometers, etc., can solve problems such as damage, complicated measurement technology operations, and affecting measurement results

Inactive Publication Date: 2014-11-12
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This electrical measurement method will generate heat and affect the measurement results due to the introduction of current in the measurement.
[0004] Generally speaking, the existing measurement techniques are complicated to operate, the instruments are expensive, and some of them are destructive to a certain extent.

Method used

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  • Measuring method for junction temperature of LED (light emitting diode)
  • Measuring method for junction temperature of LED (light emitting diode)
  • Measuring method for junction temperature of LED (light emitting diode)

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with drawings and embodiments.

[0024] The measuring method described in the present embodiment comprises the following steps:

[0025] 1) Construction of the junction temperature measurement device

[0026] like figure 1 As shown, the junction temperature measurement device is provided with a temperature control fixture 4, a digital power meter 2, a computer 1 and a temperature control source meter 3;

[0027] The temperature control fixture 4 clamps the light-emitting diode to be tested, and the two poles of the digital power supply meter 2 receive the light-emitting diode to be tested. The digital power supply meter 2 is electrically connected to the computer 1, and the computer 1 is electrically connected to the temperature control source meter 3. The temperature control source meter 3 is matched The temperature sensor 31 and the heating plate 32 are all installed on the temperature control fixtur...

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Abstract

The invention discloses a measuring method for a junction temperature of an LED (light emitting diode), and relates to an LED, particularly relates to the measuring method for the junction temperature of the LED. The invention provides the measuring method without heating effect affects on the LED, with a simple measuring device and convenient operation. The method comprises the following steps of building a junction temperature measuring device; setting a group of temperature values by a temperature control source meter, setting a voltage value, and according to the set group of temperature values and the set voltage value, measuring positive current values of the LED in different temperature values; drawing a relationship graph between a current logarithm and a temperature reciprocal, and carrying out linear fitting; regulating an output voltage of a digital power supply meter, enabling the LED to be normally luminescent, and stopping the LED from being luminescent; calculating and obtaining a junction temperature value corresponding to each current value, carrying out fitting according to a relationship formula of the junction temperature and time, and obtaining a junction temperature fitting curve graph; and obtaining junction temperature values corresponding to the LED working status in different time points according to the graph.

Description

technical field [0001] The invention relates to light-emitting diodes, in particular to a method for measuring the junction temperature of light-emitting diodes. Background technique [0002] In recent years, light-emitting diode (LED) technology has developed rapidly and is widely used in fields such as backlights, traffic lights, and general lighting ([1] Sameer Chhajed, Wonseok Lee, Jaehee Cho, E. Fred Schubert, and Jong Kyu Kim, Appl.Phys.Lett.98, 071102 (2011); [2] Dong-Yul Lee, Sang-Heon Han, Dong-Ju Lee, Jeong Wook Lee, Dong-Joon Kim, Young Sun Kim, and Sung-Tae Kim, Appl. Phys. Lett. 100, 041119 (2012); [3] Toshiharu Makino, Kiyoshi Yoshino, Norihiro Sakai, Kouji Uchida, Satoshi Koizumi, Hiromitsu Kato, Daisuke Takeuchi, Masahiko Ogura, Kazuhiro Oyama, Tsubasa Matsumoto, Hideyo Okushi, and Satoshi Yamasaki, Appl. Phys. Lett. 99, 061110 (2011)). Because semiconductor devices, especially power semiconductor devices, will generate a lot of heat when they work, the tem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K11/00G01R31/26
Inventor 吕毅军林思棋吴弼卿姚琦朱丽虹陈国龙高玉琳陈忠
Owner XIAMEN UNIV