Packaging structure shared by heat dissipation channel and ground wire channel in three-dimensional packaging

A heat dissipation channel, three-dimensional packaging technology, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of difficult management of heating areas, difficult grounding, no heat dissipation path, etc., to improve heat dissipation and grounding effects, reduce packaging costs, Simple and compact structure

Active Publication Date: 2013-08-07
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, three-dimensional packaging brings greater challenges to conditions such as heat dissipation and grounding while increasing integration density and improving high-frequency and high-speed performance.
Due to the improvement of integration density, the three-dimensional stacking structure doubles the power density of the system, making it more difficult to manage the heat-generating area; the three-dimensional stacking structure keeps the chips sandwiched in the middle in a closed environment, without a suitable heat dissipation path; It becomes difficult to achieve a good grounding of the entire chip in the middle chip, and power integrity control is even more difficult

Method used

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  • Packaging structure shared by heat dissipation channel and ground wire channel in three-dimensional packaging

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0015] like figure 1 As shown: in order to improve the heat dissipation and grounding effect in the three-dimensional packaging without increasing the packaging area, the present invention includes a chip 1, and the chip 1 includes a substrate 11, and the substrate 11 includes power connection holes, heat dissipation Ground hole and signal connection hole; the power connection hole is filled with a power connection conductor 8, the heat dissipation ground hole is filled with a heat dissipation ground conductor 3, and the signal connection hole is filled with a signal connection conductor 4, and the power connection conductor 8 passes through the power supply The insulating layer 10 in the connection hole is insulated and isolated from the substrate 11, and the signal connection conductor 4 is insulated and isolated from the substrate 11 through the insulating l...

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Abstract

The invention relates to a packaging structure shared by a heat dissipation channel and a ground wire channel in three-dimensional packaging. The packaging structure comprises a packaging chip, wherein the packaging chip comprises a substrate; the substrate internally comprises a power connecting hole, a heat dissipation grounding hole and a signal connecting hole; a power connecting conductor is filled in the power connecting hole; a heat dissipation grounding conductor is filled in the heat dissipation grounding hole; a signal connecting conductor is filled in the signal connecting hole; the power connecting conductor is isolated from the substrate through an insulation layer in the power connecting hole; the signal connecting conductor is isolated from the substrate through an insulation layer in the signal connecting hole; a heat sink ground plane plate is arranged above the packaging chip; a base plate is arranged under the packaging chip; the heat sink ground plane plate is arranged in the base plate; an upper end of the heat dissipation grounding conductor is contacted with the heat sink ground plane plate; and a lower end of the heat dissipation grounding conductor is contacted with the heat sink ground plane plate in the base plate. The packaging structure has a simple and compact structure, is favorable to improve a heat dissipation effect and a grounding effect of three-dimensional packaging, is wide in application range, and is safe and reliable.

Description

technical field [0001] The invention relates to a package structure, in particular to a package structure shared by a heat dissipation channel and a ground wire channel in a three-dimensional package, and belongs to the technical field of microelectronic package. Background technique [0002] With the development of people's requirements for electronic products in the direction of miniaturization, multi-function, and environmental protection, people strive to make electronic systems smaller and smaller, with higher integration and more functions. , resulting in many new technologies, new materials and new designs, among which stacked chip packaging technology and system-in-package (System-in-Package, SiP) technology are one of the typical representatives of these technologies. [0003] Three-dimensional packaging technology refers to expanding the packaging structure from two-dimensional layout to three-dimensional layout, and achieving higher density and higher performance ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/48
CPCH01L2924/0002H01L2924/00
Inventor 于大全薛恺
Owner NAT CENT FOR ADVANCED PACKAGING
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