Self-adaption imprinting head for large-area nano imprinting

Abstract

The invention discloses a self-adaption imprinting head for large-area nano imprinting. The self-adaption imprinting head comprises a one-dimensional displacement platform, a connecting bracket, a connecting plate, springs and a guide column, wherein a vertical plate of the one-dimensional displacement platform is connected with the connecting bracket, one ends of the springs are placed in grooves in a bottom plate of the connecting bracket, the other ends of the springs are placed in grooves of the connecting plate, and the guide column penetrates through the connecting plate and the springs and is connected with the bottom plate of the connecting bracket. The self-adaption imprinting head has the advantages of simple structure, convenience in regulation, low cost, wide adaptability and high flexibility. The self-adaption imprinting head can be applied to nano imprinting of the whole wafer and nano imprinting of a roller to roller type, and is particularly suitable for nano imprinting of a roller to plane type. The self-adaption imprinting head provides an effective solution for development of a large-area nano imprinting photoetching process and equipment.

Description

Technical field [0001] The invention relates to an imprint head for nano-imprint lithography, in particular to an adaptive imprint head for large-area nano-imprint lithography, and belongs to the technical field of micro-nano manufacturing and precision machinery. Background technique [0002] Nanoimprint Lithography (NIL) is a new micro-nano patterning method, which is a technology that uses a mold to realize its patterning through the force and deformation of a polymer. Compared with other micro-nano manufacturing methods, NIL has the characteristics of high resolution, ultra-low cost and high productivity, especially in the manufacture of large-area micro-nano structures and complex three-dimensional micro-nano structures. [0003] NIL is a contact complex process. Due to the mechanical errors of the nanoimprint structure and the unevenness of the substrate itself (there is warpage and deformation, especially for LED epitaxial wafers), there are non-parallel errors in the nanoim...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of non-parallelism between the mold and the substrate, unevenness of the substrate and wedge error compensation in the process of nano-imprinting, and to provide a self-sufficient tool suitable for large-area nano-imprinting process. Adapts to the imprint head for non-parallelism adjustment between mold and substrate, wedge error compensation and good conformal contact

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