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Solar cell module and method for manufacturing same

A solar cell and manufacturing method technology, which is applied to circuits, electrical components, photovoltaic power generation, etc., can solve the problems of thermal expansion difference, warpage and damage of solar cell components, and increase in manufacturing cost, and achieves the effect of small warpage.

Inactive Publication Date: 2013-08-21
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First, the silver (Ag) used as the material of the bus electrode on the light-receiving surface is expensive, and a large amount of silver is required to form a width of 1 to 2 mm, so the manufacturing cost increases
Second, although the wiring member is bonded over the entire length of the solar cell, the solar cell element may be warped and damaged due to the difference in thermal expansion between the silicon of the solar cell element and the copper of the wiring member.

Method used

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  • Solar cell module and method for manufacturing same
  • Solar cell module and method for manufacturing same
  • Solar cell module and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0027] figure 1 is a diagram showing the structure of a solar cell module according to Embodiment 1 of the present invention, figure 1 (a) is a cross-sectional view of the solar cell module, figure 1 (b) is a perspective view of a series group in which a plurality of solar cell elements 1 are connected by a wiring member 5 , figure 1 (c) is a cross-sectional view of the joint portion of the thin wire electrode (first collector electrode) 2 a and the wiring member 5 , figure 1 (d) is a cross-sectional view showing a junction between the light receiving surface 1 a and the wiring member 5 .

[0028] according to figure 1 (a), the solar battery module 100 is provided with a light-receiving surface protection member 11 on the light-receiving surface 1 a side of the solar battery series group 10 , and a rear surface protection member 12 is arranged on the back surface 1 b side, and between the solar battery series group 10 and the protection members 11 and 12 The sealing member...

Embodiment approach 2

[0039] figure 2 It is a figure which shows the solar cell module of Embodiment 2 of this invention, and is for demonstrating the method of bonding the solar cell element 1 and the wiring member 5 in order. figure 2 ( a0 ) is a plan view of the light receiving surface 1 a of the solar cell element 1 . A plurality of thin wire electrodes 2a are formed in parallel on the light receiving surface 1a. figure 2 (a1) is figure 2 The cross-sectional view along line AA of ( a0 ) shows a cross-section of the thin wire electrode 2 a in a direction intersecting the wiring member 5 . figure 2 (a2) is figure 2 The cross-sectional view along line BB of ( a0 ) shows the cross-section of the region other than the thin wire electrode 2 a.

[0040] figure 2 (b0) is a plan view of the light-receiving surface 1a in a state where the thermosetting epoxy resin composition 4a before curing is arranged, and the above-mentioned thermosetting epoxy resin composition 4a contains an organic aci...

Embodiment approach 3

[0048] image 3 It is a figure which shows the solar cell module of Embodiment 3 of this invention, and is used for demonstrating the bonding method of the solar cell element 1 and the wiring member 5. image 3 (a0) is a figure for demonstrating the method of joining the wiring member 5 of the solar cell element 1. image 3 (a1) is image 3 (a0) A cross-sectional view corresponding to the line A-A. image 3 (a2) is image 3 (a0) Cross-sectional view corresponding to line BB. A plurality of thin wire electrodes 2a are formed in parallel on the light receiving surface 1a of the solar cell element 1 .

[0049] image 3 (b0) is a diagram showing the state where the thermosetting epoxy resin composition 4b before curing is arranged. The thermosetting epoxy resin composition 4b is narrower than the width of the wiring member 5 and contains an organic acid or Organic acids are used in hardeners. image 3 (b1) is image 3 (b0) A cross-sectional view corresponding to the line A...

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Abstract

A solar cell module, wherein: a plurality of thin-wire electrodes (2a) shaped as thin lines are formed across an entire first surface, which is a light-receiving surface (1a), of a solar cell element (1); a reverse-surface collecting electrode (2b) is formed on a second surface, which is a reverse surface (1b), of the solar cell element (1); and a wiring material (5) for bringing out electrical power is connected to each of the thin-wire electrodes (2a) and the reverse-surface collecting electrode (2b). The thin-wire electrodes (2a) and the wiring material (5) are joined by solder. A longitudinal lateral surface along the wiring material (5) of a solder-joined section is coated with a thermosetting resin. In regions other than the thin-wire electrodes (2a), the wiring material (5) and the first surface are bonded by a thermosetting resin. The wiring material (5) and the thin-wire electrodes (2a) are joined so as to have sufficient mechanical joint strength and high joint reliability.

Description

technical field [0001] The present invention relates to a solar cell module in which solar cell elements are connected by a wiring member and a method for manufacturing the same. Background technique [0002] Conventionally, a solar cell element is configured to include: a silicon substrate; a thin wire electrode for collecting photogenerated carriers generated in a photoelectric conversion region of the silicon substrate; The light-receiving surface bus electrode (electrode for connecting the light-receiving surface wiring member) that transmits the light-generated carriers to the output wiring member. [0003] The output wiring member is a thin strip-shaped copper foil made of copper (Cu), and the light-receiving surface bus electrode (electrode for connecting the light-receiving surface wiring member) is an electrode for joining the wiring member of the copper foil. formed to intersect the thin wire electrodes. The light-receiving surface bus electrode is formed by firi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/04
CPCH01L31/0508H01L31/0512Y02E10/50H01L31/0504
Inventor 滨口恒夫薮垣良美越前谷大介宫本慎介
Owner MITSUBISHI ELECTRIC CORP
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