Modularized temperature control device
A temperature control device and temperature control technology, which are applied in the direction of using electric mode for temperature control, etc., can solve the problems of low temperature in the inflow section, uneven temperature of the cooling surface, and high temperature in the outflow section. The effect of improved uniformity
Active Publication Date: 2015-06-17
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology
However, the serpentine flow channel will cause the temperature inhomogeneity of the cooling surface, the temperature of the inflow section is low, and the temperature of the outflow section is high
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[0036] In order to better understand the technical content of the present invention, specific embodiments are given together with the attached drawings for description as follows.
[0037] The temperature control system can provide temperature control solutions for various components, such as the temperature control of the internal measurement system of the lithography machine, the flexible support block of the objective lens, the main substrate, the measurement bracket, the planar motor, and the light source electric control cabinet. Among them, the medium (such as: water) cooling control is mainly aimed at the measurement system installed in the inner world of the frame. Among them, the upper surface of the measurement bracket mainly carries the mask table interferometer system; the upper surface of the main substrate is arranged with a projection objective lens and an off-axis Alignment system; more measurement systems are suspended on the bottom of the main substrate, inclu...
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The invention provides a modularized temperature control device which comprises a medium drive pump, a temperature control unit and a plurality of medium cooling modules which are connected with one another in sequence, wherein the medium drive pump is provided with an electric pump control unit. Each medium cooling module comprises a medium cooling substrate module upper board, a medium cooling substrate module lower board and fast connection joints, wherein the medium cooling substrate module upper board and the medium cooling substrate module lower board are connected with each other, and the fast connection joints are arranged on the side face of the medium cooling substrate module lower board. The medium cooling substrate module lower board is provided with a square double helix inner cavity, four fluid ports are formed in the periphery of the square double helix inner cavity, and the fluid ports are connected with the fast connection joints. According to the modularized temperature control device, the design idea is based on modularization, a heat exchange interface in a measurement system is designed to be a modularized medium cooling substrate, fast installation and configuration are facilitated, a structure style which meets the requirements of a work condition is combined by basic modules, the structure style meets the engineering requirements of multi-system cooling in a photoetching machine.
Description
technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, and in particular to a modularized temperature control device applied to a photolithography machine. Background technique [0002] The control of the temperature field is a major problem in opto-mechatronic devices. Especially for precision mechanical devices, such as lithography machines whose precision is required to reach the nanometer level, the importance of temperature control for the entire device and important parts in the device is particularly prominent. [0003] In the internal world of the lithography machine, in addition to the main substrate and the measurement bracket, the most important measurement system is also arranged. In the whole machine, these measuring devices located in the internal world are collectively called the measuring system. Among them, the upper surface of the measurement bracket mainly carries the mask table interferometer system;...
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IPC IPC(8): G05D23/19
Inventor 吴飞龙鹏程魏巍袁志扬张洪博
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD