Chip mounter detection device

Abstract

The invention provides a chip mounter detection device, which comprises an assembly to be detected, a light source, a cover body and a shooting module, wherein the light source is arranged on the side edge of the assembly to be detected; the light source is covered by the cover body; the inner surface of the cover body is provided with an atomization reflecting layer; an opening is formed in the upper end of the cover body; the shooting module is arranged above the opening; and the shooting module is used for detecting against the assembly to be detected through the opening. According to the chip mounter detection device, the light source is covered by the atomization reflecting layer of the cover body, so that high-brightness uniform illumination can be provided for the assembly to be detected; and meanwhile, the assembly to be detected is not influenced by external light rays, and the accuracy of the shooting module on the aspect of image alignment detection can be increased.

Description

technical field [0001] The invention relates to a detection device for a mounter, in particular to a detection device for a mounter which can provide uniform illumination. Background technique [0002] As the trend of light-emitting diodes (LEDs) being used as panel backlights takes shape, and LEDs are not only used in small and medium-sized panels, but also develop towards large-sized panels, the packaging and bonding technology related to LED light bars (Light Bar) is relatively important. At present, the manufacture of LED light strips is to stick a plurality of granular LED chips on the strip-shaped circuit board through Surface Mount Technology (SMT). In the surface mount technology, the chip mounter is the key equipment. Mounting accuracy has high standard requirements. Generally speaking, the current placement machine generally adopts the visual centering system to align the placement. The vision centering system is based on the fact that after the placement head abs...

AI Technical Summary

Problems solved by technology

However, in the current image acquisition process of patch components, due to the way of illumination (whether it is directly illuminated from above or from the side), it does not take into account that the surface of the patch component may have curvature, which is difficult to focus and the characteristics of optical identification, so that the above-mentioned There will be shortcomings such as uneven lighting or ring light reflections that affect visual accuracy

In addition, the external ambient light where the placement machine is located may also affect the visual accuracy and make the placement position shift, so it is necessary to further study and improve

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