Unlock instant, AI-driven research and patent intelligence for your innovation.

Dual-interface smart card and manufacturing technique thereof

A dual-interface smart card and manufacturing method technology, which is applied to record carriers, instruments, computer parts, etc. used in machines, and can solve problems such as poor contact and slow speed.

Active Publication Date: 2013-09-18
薛渊
View PDF13 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The inventor has found through long-term research and practice that the traditional technology of dual-interface smart cards is not without merits. Its slow speed is that the step of picking up the thread is not easy to be accurately clamped by the fixture to realize automation, and the shortcoming that the antenna is easy to be milled off is needed. Overcome, but it can be used as a visual inspection indicator for the quality of milling slots; in addition to the aforementioned shortcomings, the recently developed new technology, even if the welding is firm, but due to the tight constraints of the antenna and welding points and the extrusion of the IC chip, frequent contact in daily use Card reading or bad usage habits (such as repeated bending, large changes in ambient temperature during use) will cause slight displacement of the chip and separation from the antenna, resulting in poor contact

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dual-interface smart card and manufacturing technique thereof
  • Dual-interface smart card and manufacturing technique thereof
  • Dual-interface smart card and manufacturing technique thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 5 manufacture approach example 1

[0054] As an embodiment of the present invention, the steps of the manufacturing method are as follows:

[0055] (1) Embedding the antenna 13 on the antenna layer 1:

[0056] The antenna layer 1 of polyvinyl chloride PVC material (for example, available from Shanghai Youpu Plastic Co., Ltd., model: YP101A) has a front side 1 a and a back side 1 b. Such as figure 1 and figure 2As shown, the antenna 13 with insulating paint on the surface (for example, the direct solderable polyurethane enamelled round copper wire that can be purchased from Shanghai Dingqiang Electric Equipment Co., Ltd., model: QA-12UEW wire) is embedded in the antenna On the back side 1b of the layer 1, ie on the side surface facing the back protective layer 4. The antenna 13 starts from a position 13e (also referred to below as the third groove 24) outside the area corresponding to but smaller than the area where the IC chip 8 is placed (that is, falling within the range of the vertical projection of the ...

Embodiment 2 5 manufacture approach example 2

[0070] Basically the same as Embodiment 1, the difference is that the slit 12 in Embodiment 1 is omitted, but the width of the two overlapping parts 25 is relatively narrow (such as no more than 1.2mm, such as 1mm, 0.8mm), as long as it can It is sufficient to cover the antenna 13 at the position 13c and the position 13d respectively. When using an automated jig to lift the isolated block area 11 from the card base, the overlapping portion 25 is broken, so that the isolated block area 11 is detached from the card base.

[0071] The dual-interface smart card produced in this way is the same as that of Embodiment 1.

Embodiment 3 5 manufacture approach example 3

[0073] It is basically the same as Embodiment 1, except that the position 13e is located outside the isolated block area 11 but within the outer edge of the third groove 24 .

[0074] The dual-interface smart card produced in this way does not have the antenna residue at position 13e compared to that of Embodiment 1, specifically, it includes a card base, an IC chip 8 and an antenna 13, wherein the card base is composed of five layers of lamination, which means The five layers from the front to the back are the front protective film 2, the front protective layer 3, the antenna layer 1, the back protective layer 4 and the rear protective film 5 (such as Figure 4 shown); the front of the card base has a groove capable of accommodating (preferably fitting) the IC chip 8, and the outer edge of the groove is surrounded by a ring-shaped first groove 21 for supporting the IC chip 8; the depth of the first groove 21 Equal to the thickness of the IC chip 8, but not as deep as the back...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a dual-interface smart card and a manufacturing technique thereof. The manufacturing technique includes: embedding an antenna on the back of an antenna layer, wherein the antenna embedded in an isolated block area is S-shaped; arranging a separation film on the isolated block area; milling grooves with accommodating gaps; and lifting up the isolated black area to be electrically connected with an IC (integrated circuit) chip. The manufacturing method is convenient for automating, setting and positioning, good in raw material adaptability, less prone to line break, high in speed, needless of complex steps and low in requirements on welding technology, and the dual-interface smart card manufactured by the manufacturing technique is less prone to poor contact in daily use and can even have an ant-disassembling or anti-counterfeiting function.

Description

technical field [0001] The invention belongs to the field of recording carriers with integrated circuit (IC) chips, in particular, the invention relates to a manufacturing process of a dual-interface smart card and the manufactured dual-interface smart card. technical background [0002] Smart cards with integrated circuit chips have been widely used in banking and micropayments, telephone communications, public transport systems, and public services. Although contactless card reading methods such as wireless communication and near field communication (NFC) have become research hotspots, contact card reading facilities in existing banks, communications and public service institutions are common, and the number accounts for the vast majority. , The cost of all updates is huge, and the contactless card reading and writing method does not conform to the habits of some consumers. [0003] Therefore, a dual-interface smart card includes two to seven protective layers mainly made...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06K19/077
CPCG06K19/145G06K19/0723
Inventor 薛渊
Owner 薛渊