Light emitting diode packaging structure
A light-emitting diode, light-shielding technology, applied in electrical components, semiconductor devices, electro-solid devices, etc., can solve problems such as product defects, influence, and inability to effectively provide heat dissipation solutions, and achieve the enhancement of overall light output and high heat dissipation effect. Effect
Inactive Publication Date: 2013-09-18
LEXTAR ELECTRONICS CORP
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Problems solved by technology
[0003] However, since the heat dissipation effect of the above-mentioned traditional light-emitting diode grains still needs to be improved, it is easy to cause material degradation, which in turn leads to defective products, and it is impossible to effectively provide a better heat dissipation solution.
In addition, if the sidewall structure of the traditional light-emitting diode grain is thin, it will not be able to effectively shield the output of light, causing light to be transmitted through the plastic, affecting the reduction of the brightness of the light-emitting surface
[0004] It can be seen that the above-mentioned existing light-emitting diode crystal grains obviously still have inconvenience and defects, and need to be further improved.
Method used
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[0056] The following will clearly illustrate the spirit of the present invention with illustrations and detailed descriptions. After those skilled in the art understand the embodiments of the present invention, they can be changed and modified by the techniques taught in the present invention without departing from the spirit of the present invention. Spirit and scope.
[0057] see Figure 1A , Figure 1B as shown, Figure 1A It is a side view of an embodiment of the LED packaging structure 100 of the present invention. Figure 1B for Figure 1A Partial enlarged view of area M.
[0058] The present invention provides a light emitting diode packaging structure 100 . The LED packaging structure 100 includes a base 200 , a first wire frame 310 , a second wire frame 320 , a LED chip 400 , a heat conduction film 500 and an encapsulant 600 .
[0059] The base 200 includes a reflection groove 210 , a plurality of inner surfaces 211 and outer surfaces 212 . These inner surfaces 21...
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A light emitting diode packaging structure provided in the invention includes a base, a plurality of lead frames, a LED chip, a thermal conductive film and an encapsulating member. The base includes a reflective recess and a plurality of outer surfaces surrounding the reflective recess. The lead frames are respectively disposed on the base, and exposed from the reflective recess. The LED chip is disposed on one of the lead frames in the reflective recess The thermal conductive film is with a light shielding property, and covers all inner surfaces of the reflective recess and at least one of the outer surfaces of the base. The encapsulating member is disposed in the reflective recess to cover the thermal conductive film and the LED chip.
Description
technical field [0001] The invention relates to a light-emitting diode element, in particular to a light-emitting diode element with a heat-conducting film. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a kind of compound semiconductor, which utilizes the energy released in the form of light when electrons and holes in P-type and N-type semiconductor materials are combined. In addition, due to the advantages of small size, long life, low power consumption, and fast response rate, light-emitting diodes have been widely used in optical display devices, communication devices, and lighting equipment in recent years, becoming an indispensable optoelectronic in daily life. element. [0003] However, since the heat dissipation effect of the traditional light-emitting diode grains still needs to be improved, it is easy to cause material degradation, and then lead to defective products, and it is impossible to effectively provide a better heat d...
Claims
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IPC IPC(8): H01L33/64
CPCH01L33/60H01L33/642H01L33/644H01L2224/48091H01L2224/73265H01L2924/00014
Inventor 邱冠谕
Owner LEXTAR ELECTRONICS CORP