Manufacturing method of plastic parts and surface conductor structures thereof

Abstract

The invention relates to the field of conductor structure manufacture and discloses a manufacturing method of plastic parts and surface conductor structures thereof. The manufacturing method comprises the steps of adding mineral powder into plastic materials; utilizing the plastic materials with the added mineral powder to produce the plastic parts; utilizing lasers to irradiate partial areas of the surfaces of the plastic parts to enable the surface adsorption capability of the irradiated areas to be higher than that of areas which are not irradiated; soaking the plastic parts which are irradiated through the lasers into activating agents to perform chemical activation treatment to enable metal atoms in the activating agents to be adsorbed by the irradiated areas; and placing the plastic parts through the chemical activation treatment into chemical reduction solutions to enable the irradiated areas to form into metal thin layers. According to the manufacturing method of the plastic parts and the surface conductor structures of the plastic parts, the manufacture of the surface conductor structures can be achieved through normal plastic materials, the high adsorption capability mineral powder has multiple low cost options, and special plastic materials and special dopant are utilized in the prior art, so that the costs are greatly reduced; the chemical reduction time is reduced by 10 to 20% in comparison with the prior art; and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of conductor structure manufacturing, in particular to a plastic part and a method for manufacturing a surface conductor structure thereof. Background technique [0002] Laser Direct Structuring (LDS for short) technology is one of the current methods for realizing three-dimensional circuits. Its process is to use special materials to make structural parts (this material can be activated by laser to achieve selective plating) , Mark the required graphics on the surface of the workpiece by laser, and then electroplate a metal layer to form a circuit. [0003] Chinese Patent No. 02812609 describes a conductor track structure and its manufacturing method. The conductor track structure consists of a metal core and a metallization layer subsequently applied to the metal core. The conductor track structure is located on a non-conductive carrier material into which a non-conductive metal compound has been doped. The area ...

AI Technical Summary

Problems solved by technology

However, the disclosed method is costly

Firstly, the non-conductive metal compound incorporated in the non-conductive carrier material for the manufacture of the conductor track structure is highly thermally stable, stable and insoluble in aqueous acidic or alkaline metallization electrolytes, non-conductive Based on higher-order oxides of spinel or simple d-metal oxides or mixtures thereof similar in structure to spinel, it can be seen that the performance and structure requirements of the non-conductive metal compound are relatively high, and the price is expensive; secondly, it can The cost of carrying materials mixed with the above-mentioned non-conductive metal compounds is relatively high, which also causes certain restrictions.

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