A vacuum packaging method applied to microelectromechanical system devices
A technology of micro-electromechanical systems and vacuum packaging, which is applied to the process for producing decorative surface effects, micro-structure devices, and manufacturing micro-structure devices. It can solve problems affecting device performance and limitations, and achieve simplified processes, low cost, and The effect of high vacuum
Active Publication Date: 2015-10-14
XIAMEN UNIV
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Problems solved by technology
However, the thermal stress introduced by local heating in laser processing will greatly affect the performance of the device, which limits the practical application of this method.
Method used
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[0037] see Figure 1-7 , using an anisotropic wet etching process to process a groove 12 on the back of the glass sheet 1, using wet etching, sandblasting or laser micromachining techniques to process a conical through hole 11 on the front of the glass sheet, and then on the groove sputtering Ti getter film 13;
[0038] Use an anisotropic wet etching process to process a trapezoidal groove 21 on the SOI or SOG sheet 2, etch a mass block 22, drive the anchor point 23, drive the pair of comb teeth 25, resonant beam 26, detect the pair of comb teeth 27, and detect Anchor points 28 and microfluidic channels 24;
[0039] The glass sheet 1 and the SOI or SOG sheet 2 are bonded together by silicon-glass anode bonding technology to form a combined sheet 3;
[0040] Al electrode 31 and UBM multilayer metal film 32 (Ti / Ni / Au) are sputtered on the side wall of the conical through hole and the unbonded silicon surface at the bottom of the hole in the combined sheet 3;
[0041] Place th...
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Abstract
The invention discloses a vacuum packaging method for micro-electro-mechanical system devices, and relates to a vacuum packaging method for micro devices. A groove and through holes are made on the back of a glass sheet, and a getter film is sputtered on the groove. Dovetail grooves, a resonance structure and micro channels are processed on an SOI sheet or an SOG sheet. A combination sheet is formed by bonding the glass sheet and the SOI sheet or the SOG sheet. Electrodes and under bump metal layers are sputtered on side walls of the through holes and silica surfaces unbonded at the bottom of the holes of the combination sheet. The bonded combination sheet is disposed in an injection glue dispenser, and metal solder balls are sprayed on the through holes. The combination sheet sprayed with the solder balls is disposed in a vacuum bonding machine. Gas in a chamber is exhausted through micro channels by vacuumizing and heating, solder flows back, and pressure is applied on the combination sheet by the bonding machine. A glass cover is employed on the bonding machine to ensure that the solder does not flow outside the through holes. The melted solder is squeezed into the micro channels for sealing the through hole holes and the micro channels, so that the vacuum packaging for the MEMS devices is achieved.
Description
technical field [0001] The invention relates to a vacuum packaging method for micro devices, in particular to a vacuum packaging method for microelectromechanical systems (MEMS) devices using precision jet dispensing technology, which can be used for resonant pressure sensors, micro gyroscopes and MEMS resonators, etc. Tiny devices that work in a highly airtight vacuum environment. Background technique [0002] Micro-electromechanical systems (MEMS) technology is mainly used to make micro-sensors, micro-actuators, micro-components, micro-optical devices, etc. With the rapid development of MEMS technology, mechanical, electronic and other scientific research institutions and enterprises have developed a large number of MEMS chips, but most of them are difficult to put into actual production. One of the main reasons is that the packaging problem has not been resolved. [0003] MEMS vacuum packaging can significantly improve system performance and long-term reliability of freq...
Claims
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IPC IPC(8): B81C1/00
Inventor 孙道恒何杰占瞻杜晓辉邱小椿李益盼刘益芳王凌云
Owner XIAMEN UNIV