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Resin composition, and printed wiring board, laminated sheet, and prepreg using same

一种树脂组合物、预浸料坯的技术，应用在印刷电路、印刷电路、印刷电路零部件等方向，能够解决压制成形不良、翘曲变大、绝缘可靠性降低等问题

Active Publication Date: 2013-09-25
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Especially in recent years, with the miniaturization and thinning of packaging substrates for semiconductors, there is a problem of increased warpage due to the difference in thermal expansion coefficient between the chip and the substrate during component mounting and package assembly, and low thermal expansion is required. However, increasing the filling amount is known to cause a decrease in insulation reliability due to moisture absorption, insufficient adhesion of the resin-wiring layer, and poor press molding

Method used

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  • Resin composition, and printed wiring board, laminated sheet, and prepreg using same
  • Resin composition, and printed wiring board, laminated sheet, and prepreg using same
  • Resin composition, and printed wiring board, laminated sheet, and prepreg using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10、 comparative example 1～3

[0102] Using components (a) to (d) shown below, (e) curing accelerator, (f) inorganic filler, and methyl ethyl ketone as a diluting solvent, follow the compounding ratio shown in Table 1 to Table 3 (parts by mass) were mixed to obtain a uniform varnish having a resin component of 65% by mass.

[0103] Next, the above-mentioned varnish was dip-coated on an E-glass cloth with a thickness of 0.1 mm, and heated and dried at 160° C. for 10 minutes to obtain a prepreg having a resin content of 50% by mass.

[0104] Four of these prepregs were stacked, and 18 μm electrolytic copper foils were arranged above and below the prepregs, and pressed at a pressure of 2.5 MPa and a temperature of 230° C. for 90 minutes to obtain a copper-clad laminate.

[0105] Tables 1 to 3 show the measurement and evaluation results of the obtained copper-clad laminated board.

[0106] (a) Maleimide compound

[0107] Bis(4-maleimidephenyl)methane

[0108] 3,3-Dimethyl-5,5-diethyl-4,4-diphenylmethane bismal...

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Abstract

Provided are: a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in each molecular structure, and (b) a silicone compound having at least one amino group in each molecular structure; and a printed wiring board, a laminated sheet, and a prepreg using the resin composition. A printed wiring board manufactured using a laminated sheet which has been formed by laminating a prepreg obtained from this resin composition has an excellent glass-transition temperature, coefficient of thermal expansion, solder heat-resistance, and flexing properties, and can be used as a printed wiring board for highly integrated electronics.

Description

technical field [0001] The present invention relates to a resin composition having insulating properties, heat resistance, etc., and particularly excellent low thermal expansion, which is used for electronic parts and the like, and a prepreg, a laminate, and a printed wiring board using the resin composition. Background technique [0002] In recent years, with the popularity of miniaturization and high performance of electronic equipment, the wiring density and high integration of printed wiring boards have intensified, and accordingly, the improvement of heat resistance based on the improvement of wiring laminates is reliable. Sexual demands are intensified. In such applications, both excellent heat resistance and low thermal expansion coefficient are required. [0003] As a laminated board for printed wiring boards, generally, a resin composition containing an epoxy resin as a main ingredient and a glass woven fabric are solidified and integrally molded. In general, epox...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/08C08G59/40C08J5/24C08K3/00C08K5/13C08K5/18C08K5/3415C08K5/3445C08L63/00C08L79/00H05K1/03
CPCC08J2379/08C08L79/085H05K1/0353H05K1/0366H05K2201/0162C08K5/13C08K5/18C08K5/3415C08K5/3445C08G73/0655C08G77/26C08G77/388C08J5/244C08J5/249C08L83/08C08L63/00C08L79/04C08J5/24H05K1/0373C08J2383/08C08K3/014C08J2479/08C08G77/14C08L83/06H05K1/0313
Inventor 长井骏介宫武正人小竹智彦桥本慎太郎井上康雄高根泽伸村井曜
Owner RESONAC CORPORATION
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