Turnover degumming all-in-one machine

Abstract

The invention discloses a turnover degumming all-in-one machine which comprises a machine frame, a loading guiding frame, a mechanical arm, a lifting workpiece holder, a wafer box, a turnover mechanism and a plurality of heating degumming groove bodies. The turnover mechanism is used for turning over a connecting plate, wherein wafers are stuck to the front face and the back face of the connecting plate. The loading guiding frame, the turnover mechanism and the heating degumming groove bodies are sequentially arranged in parallel. A mechanical arm track device is arranged at the upper portion of the machine frame. The mechanical arm is installed on the mechanical arm track device in a slidable mode and located above the loading guiding frame, the turnover mechanism and the heating degumming groove bodies. The lifting workpiece holder is installed on the mechanical arm. According to the turnover degumming all-in-one machine, manual degumming can be achieved, the quality of the wafers is improved, the wafer burning phenomenon and injury accidents are avoided, and the semi-automatization operation in the washing and degumming processes is achieved.

Description

technical field [0001] The invention relates to a turning and degumming all-in-one machine, which belongs to the technical field of the photovoltaic industry and is mainly used for manually degumming and taking silicon wafers from single and polycrystalline silicon wafers in the photovoltaic industry. Background technique [0002] At present, most silicon wafer manufacturing enterprises now use automatic degumming and taking, especially after the production capacity of silicon wafers reaches a certain scale, they will resist manual degumming in order to reduce the loss of artificial degumming. After our long-term certification, the loss rate of manual degumming is less than that of automatic degumming, and the probability of dirty chips is basically eliminated, while automatic degumming needs to go through high temperature and lactic acid, etc. Very strict, prone to injury accidents. Silicon ingots are ground and cut to produce silicon wafers. The general cutting mechanism ...

AI Technical Summary

Problems solved by technology

In order to increase the production capacity of slicing, we all adopt the method of one-piece sticky sticks, and the one-piece connecting plate is very bulky and cannot be turned over manually, requiring the help of a machine. At present, there is no standard tooling in the market, so through the joint efforts of our equipment and process team, The semi-automatic method is used for turning and lifting, and the manual method is used for degumming. Through this principle, an all-in-one machine has been developed.

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