Multipurpose encapsulating equipment

Abstract

The invention discloses multipurpose encapsulating equipment, which comprises a base, a dispensing mechanism, an encapsulating table, a movement mechanism, a sheet carrying table, a main shaft, at least two sheet loading swinging arms, a first driving device and a second driving device, wherein the movement mechanism is used for driving the encapsulating table to move; the sheet carrying table is arranged on the base, is positioned on one side of the encapsulating table, and is used for accommodating a prepared bare chip and an electronic element; the main shaft is arranged between the encapsulating table and the sheet carrying table; the sheet loading swinging arms are arranged on the main shaft, and are arranged uniformly along the circumferential direction of the main shaft; suction nozzles of different specifications are arranged on the sheet loading swinging arms; the first driving device is connected with the main shaft, and is used for driving the main shaft to rotate along the circumferential direction so as to drive the sheet loading swinging arms to switch between the encapsulating table and the sheet carrying table serving as two points; the second driving device is connected with the sheet loading swinging arms, and is used for driving the sheet loading swinging arms to move along the axial direction of the main shaft. According to the multipurpose encapsulating equipment, the aim of finishing encapsulation operation of hybrid circuits on one piece of equipment is fulfilled.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a multipurpose packaging device. Background technique [0002] In the current packaging equipment, the packaging operations for processing bare chips and electronic components generally need to be realized by different equipment. For the packaging of bare chips, due to the high precision requirements, it is usually packaged by a chip mounter; for the packaging of electronic components, it is generally achieved by a placement machine. The placement machine can process a variety of electronic components at high speed at the same time, but it cannot meet the loading accuracy requirements of bare chips; The setting can only handle one kind of bare chip or electronic component, and manual setting is required when changing products, which is time-consuming and laborious. Therefore, it is not suitable for packaging that handles various electronic components. Therefore...

AI Technical Summary

Problems solved by technology

It can be seen that since the first and second loading swing arms can only complete the packaging of bare chips, their uses are relatively limited. If you want to complete the packaging of electronic components on the basis of bare chips, you need It is obviously more troublesome to replace related parts of different models and sizes, and adjust the control parameters to complete different packaging operations, and the accuracy of the operation may be affected due to human errors in the implementation. Affect packaging operations

[0004] Therefore, it can be understood from the above statement that at present, the operation of products that need to package bare chips and electronic components at the same time, such as the operation of hybrid circuits, cannot be completed at the same time on one device

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