Multipurpose encapsulating equipment

A packaging equipment, multi-purpose technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as limited use, impact on packaging operations, and impact on operation accuracy, and achieve the effect of simple operation

Active Publication Date: 2013-11-20
SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that since the first and second loading swing arms can only complete the packaging of bare chips, their uses are relatively limited. If you want to complete the packaging of electronic components on the basis of bare chips, you need It is obviously more troublesome to replace related parts of different models and sizes, and adjust the control parameters to complete different packaging op

Method used

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  • Multipurpose encapsulating equipment
  • Multipurpose encapsulating equipment
  • Multipurpose encapsulating equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This embodiment is the most preferred for implementing the present invention. Such as Figure 1-3 As shown, the multi-purpose packaging equipment in this embodiment includes a machine base 1, a dispensing mechanism 2, a packaging table 3, and a motion mechanism 31 that drives the packaging table 3 to move, and the motion mechanism 31 can drive the packaging table 3 along the X, Y Direction movement; this multi-purpose packaging equipment also includes: a wafer platform 4, which is arranged on the support 1 and is located on one side of the packaging platform 3, for placing pre-prepared bare chips and electronic components, bare chips and electronic components It can be pre-placed in a box, which is convenient for the loading swing arm to take; the main shaft 5 is arranged between the packaging table 3 and the wafer receiving table 4, and the main shaft 5 can be arranged along the Z-axis direction; two loading Swing arm 6, it is installed on the main shaft 5, and is eve...

Embodiment 2

[0041] Others are the same as those described in Embodiment 1, except that there are three chip loading swing arms, which are also installed on the main shaft 5, and are evenly arranged along the circumference of the main shaft 5, and can package three different being encapsulated.

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Abstract

The invention discloses multipurpose encapsulating equipment, which comprises a base, a dispensing mechanism, an encapsulating table, a movement mechanism, a sheet carrying table, a main shaft, at least two sheet loading swinging arms, a first driving device and a second driving device, wherein the movement mechanism is used for driving the encapsulating table to move; the sheet carrying table is arranged on the base, is positioned on one side of the encapsulating table, and is used for accommodating a prepared bare chip and an electronic element; the main shaft is arranged between the encapsulating table and the sheet carrying table; the sheet loading swinging arms are arranged on the main shaft, and are arranged uniformly along the circumferential direction of the main shaft; suction nozzles of different specifications are arranged on the sheet loading swinging arms; the first driving device is connected with the main shaft, and is used for driving the main shaft to rotate along the circumferential direction so as to drive the sheet loading swinging arms to switch between the encapsulating table and the sheet carrying table serving as two points; the second driving device is connected with the sheet loading swinging arms, and is used for driving the sheet loading swinging arms to move along the axial direction of the main shaft. According to the multipurpose encapsulating equipment, the aim of finishing encapsulation operation of hybrid circuits on one piece of equipment is fulfilled.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a multipurpose packaging device. Background technique [0002] In the current packaging equipment, the packaging operations for processing bare chips and electronic components generally need to be realized by different equipment. For the packaging of bare chips, due to the high precision requirements, it is usually packaged by a chip mounter; for the packaging of electronic components, it is generally achieved by a placement machine. The placement machine can process a variety of electronic components at high speed at the same time, but it cannot meet the loading accuracy requirements of bare chips; The setting can only handle one kind of bare chip or electronic component, and manual setting is required when changing products, which is time-consuming and laborious. Therefore, it is not suitable for packaging that handles various electronic components. Therefore...

Claims

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Application Information

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IPC IPC(8): H01L21/67
Inventor 王敕
Owner SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD
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