An Easy-to-Clean Pad Structure of Printed Circuit Board
A technology for printed circuit boards and pads, applied in the directions of printed circuit components, electrical connection printed components, etc., can solve the problems of inconvenient cleaning, uneven pads, and insufficient sealing, so as to facilitate cleaning and improve electrical connection reliability. sexual effect
Active Publication Date: 2016-12-07
中雅(重庆)彩色印刷有限公司
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Problems solved by technology
At present, in common multi-layer printed circuit boards, there are usually pads, circuit layers and insulating layers from top to bottom, wherein the pads are located on the upper surface of the circuit layer, and the insulating layer is formed with through holes. Sometimes, the position of the pads It will correspond to the position of the through hole, and part or all of it will fall into the through hole. In this case, the processing of the pad will be unreliable, and it is easy to cause false soldering due to unevenness and collapse of the pad, resulting in electrical failure of the printed circuit board. Poor connection reliability; It should be pointed out that the support structure under the pad sometimes causes glue, ink, dust, etc. to enter it due to insufficient sealing, and it is not easy to clean
Method used
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Embodiment Construction
[0014] Such as figure 1 As shown, the easy-to-clean printed circuit board pad structure according to the embodiment of the present invention includes an insulating layer 1 and a base 2, the insulating layer 1 is arranged above the base 2, and a pad 3 is arranged on the top at the center of the insulating layer 1 A through hole is provided in the insulating layer 1 below the pad 3 and a triangular reinforcing rib 4 is respectively provided on both sides of the through hole, and a conductive layer 5 is provided on the inner side of each triangular reinforcing rib 4;
[0015] A central counterweight 6 is arranged inside the closed chamber surrounded by the conductive layer 5, and an isolation belt 7 is added between the top of the central counterweight 6 and the pad 3, and the two sides of the central counterweight 6 are respectively provided A tab 8.
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The invention discloses a convenient-to-clean printed circuit board bonding pad structure, which comprises an insulating layer and a base, wherein the insulating layer is formed above the base; a bonding pad is positioned on the top of the central position of the insulating layer; a through hole is formed in the insulating layer below the bonding pad, and the inner two sides of the through hole are provided with one triangular reinforcing rib respectively; the inner side of each triangular reinforcing rib is provided with a conducting layer; a central balancing weight is arranged inside an enclosed cavity enclosed by the conducting layer; and an isolation strip is arranged between the upper side of the central balancing weight and the bonding pad. The convenient-to-clean printed circuit board bonding pad structure has the beneficial effects that the machining of the bonding pad is reliable, and insufficient solder caused by unevenness and collapse of the bonding pad is avoided, so that the electric connection reliability of a printed circuit board is improved; the triangular reinforcing ribs are arranged, so that the structure of the bonding pad is reinforced; and support force can be applied to the bonding pad from top to bottom for a long time, and a stable support structure is additionally arranged below the bonding pad, so that the bonding pad is supported.
Description
technical field [0001] The invention relates to the technical field of printing, in particular to a pad structure of a printed circuit board which is easy to clean. Background technique [0002] Printed circuit boards have developed from single-layer boards to double-sided boards, multi-layer boards, and flexible boards, and are constantly developing in the direction of high precision, high density, and high reliability, continuously reducing volume, reducing costs, and improving performance. The development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, thin wire, small pitch, high reliability, multi-layer, high-speed transmission, light weight and thin shape in terms of performance. The wires of the single-sided panel only appear on one side, and the double-sided panel is an extension of the single-sided panel, which can conduct the lines between the two layers through the via holes to ...
Claims
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IPC IPC(8): H05K1/11
Inventor 李代碧
Owner 中雅(重庆)彩色印刷有限公司