A temperature-monitorable magnetic levitation polishing device
A polishing device and magnetic levitation technology, which is applied in the direction of grinding device, grinding/polishing equipment, grinding machine tool parts, etc., can solve the problems of inability to monitor the temperature of the polishing liquid in real time and uneven polishing pressure, so as to improve the level of material removal, The effect of achieving uniformity and accelerating the corrosion rate
Active Publication Date: 2015-11-04
XIAMEN UNIV
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Problems solved by technology
[0004] The purpose of the present invention is to provide a magnetic levitation polishing device based on temperature monitoring that can overcome the problems that the existing polishing device cannot monitor the temperature of the polishing liquid in real time and the polishing pressure is not uniform
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[0019] see Figure 1~3 , the embodiment of the present invention is provided with a base 1, a waterproof cover 2, a polishing disc 3, a workpiece fixture 4, a temperature sensor 5, a computer 6, a wireless receiving module 7, a temperature-controlled single-chip microcomputer 8, a workpiece 9, a heating wire 10, and an anti-floating rail 11 , elastic electromagnetic strip coil 12, receiving magnetic strip coil 13, conductive ring 14 and polishing liquid adding device 15.
[0020] The bottom of the polishing disc 3 is processed with a vortex groove, and the heating wire 10 is embedded in the groove. The heating wire 10 is connected with the temperature-controlled single-chip microcomputer 8 through the conductive ring 14, and the temperature-controlled single-chip microcomputer 8 is connected with the computer 6. The elastic electromagnetic strip 12 is connected with the screw Connected and fixed on the base 1, the elastic electromagnetic strip 12 is composed of 16 electromagne...
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The invention provides a magnetic suspension polishing device based on monitorable temperature, and relates to chemico-mechanical polishing equipment. The magnetic suspension polishing device based on the monitorable temperature is provided with a base, a water shield, a polishing disk, electric heating wires, a conducting ring, a temperature controller, a computer, an elastic electromagnetic strip ring, a receiving magnetic strip ring, a suspension stopping rail, a workpiece fixture, a temperature sensor, a wireless receiving module and a polishing solution filling device. The water shield is arranged on the periphery of the upper end of the base in a surrounding mode, the polishing disk is fixedly arranged at the upper end of the water shield, a vortex-shaped groove is formed in the bottom of the polishing disk, the electric heating wires are embedded in the vortex-shaped groove, the electric heating wires are electrically connected with the temperature controller, the temperature controller is connected with the computer, the elastic electromagnetic strip ring is fixedly arranged on the upper surface of the base, the receiving magnetic strip ring is fixedly arranged on the bottom face of the polishing disk, the elastic electromagnetic strip ring is identical with the receiving magnetic strip ring in magnetism, the suspension stopping rail is fixedly arranged on the base and presses the elastic electromagnetic strip ring, the sensor is arranged on the periphery of the fixture, the sensor is provided with a wireless transmission module, the wireless transmission module is in wireless signal connection with the wireless receiving module arranged on the computer, and the polishing solution filling device is arranged above the side edge of the polishing disk.
Description
technical field [0001] The invention relates to chemical mechanical polishing equipment, in particular to a temperature-monitorable magnetic suspension polishing device. Background technique [0002] Chemical Mechanical Polishing (CMP) is a new technology that provides comprehensive planarization in the manufacturing process of VLSI. Its concept was first proposed by Monsanto in the United States in 1965 ([1] Dong Wei. Research status and progress of chemical mechanical polishing technology [J]. Manufacturing Technology and Machine Tools, 2012, (07): 93-97.). The basic principle of CMP technology is: the polishing sheet workpiece (Wafer) is pressed against the polishing pad under a certain pressure with the surface to be processed facing downward, and there is a polishing liquid (composed of nano-sized particle chemical oxidant, liquid, etc.) between the polishing pad and the workpiece. Under the condition of the flow of the mixed solution of equal composition), with the he...
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IPC IPC(8): B24B37/04B24B37/34B24B49/14H01L21/304
Inventor 朱睿吴沿鹏郭隐彪叶卉
Owner XIAMEN UNIV