Heat dissipation coating, heat dissipation fin and manufacturing method

Abstract

The invention is suitable for the field of heat dissipation technology. The invention discloses heat dissipation coating for dissipating heat of an electric heating device by direct or indirect contact, a heat dissipation fin and a manufacturing method. The heat dissipation coating comprises a carrier layer disposed on the outer surface of the electric heating device; and the carrier layer is uniformly provided with heat transformation layers for transforming the heat into infrared rays. When being in use, the heat dissipation coating is directly or indirectly contacted with the electric heating device through the carrier; the heat energy is transformed into the infrared rays by the heat transformation layers; and further the heat is dissipated, so that heat dissipation efficiency is high. Compared with a conventional heat dissipation coating, the heat dissipation coating provided by the invention can balance the heat dissipation efficiency in active heat dissipation while obtaining smarter size of an electronic product in passive heat dissipation, increase the heat dissipation efficiency of the electronic product, reduces the temperature of a work environment, and can be widely applied in various electronic and electromechanical products.

Description

Technical field [0001] The invention relates to the technical field of heat dissipation of electronic components, in particular to a heat dissipation coating, a heat sink and a manufacturing method for heating components. Background technique [0002] When electronic components are working, part of the electrical energy is converted into heat, which makes the electronic components work in a higher temperature environment. The heat generated by the electronic components needs to be dissipated in time, otherwise the service life and working efficiency of the electronic components will be affected. [0003] Existing electronic components and electronic products mainly have two heat dissipation methods. One is to adopt active heat dissipation. By setting a heat dissipation power device, such as an electric fan, although the active heat dissipation efficiency is better, it takes up a large space and makes the electronic product bulky. Can not be miniaturized, and active heat dissipation...

AI Technical Summary

Problems solved by technology

[0003] There are mainly two heat dissipation methods for existing electronic components and electronic products. One is to use active heat dissipation. By setting a heat dissipation power device, such as an electric fan, although the active heat dissipation efficiency is better, it takes up a lot of space and makes the volume of electronic products Cannot be miniaturized, and active cooling will increase the power consumption of electronic products

The second is to use passive heat dissipation. Although the volume of the product can be reduced, due to the low efficiency of passive heat dissipation, for electronic products with densely distributed electronic components, the operating temperature of electronic products is relatively high, which affects the use of electronic products and electronic components. Life and work efficiency

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