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Additive for electrolytic copper foil, preparation method and application thereof

A technology of electrolytic copper foil and additives, applied in electrolytic process, electroforming, etc., to achieve uniform thickness, increased tensile strength, and compact process

Active Publication Date: 2016-01-20
安徽华威铜箔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, the technical bottleneck of preparing high-performance electrolytic copper foil, especially for ultra-thin copper foil such as copper foil below 6 μmm, lies in the high temperature resistance, surface roughness, and tensile strength of electrolytic copper foil.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1: The additive for electrolytic copper foil provided in this example is made of raw material components in the following weight ratio: a-naphthoquinone 4.0-6.0: ethylenethiourea 1.0-2.0: polyethylene glycol 1.0 ~3.0.

[0022] The preparation method of the additive for electrolytic copper foil comprises the following steps:

[0023] (1) Weigh each raw material component according to the following weight ratio: α-naphthoquinone 4.0~6.0: ethylenethiourea 1.0~2.0: polyethylene glycol 1.0~3.0;

[0024] (2) Dissolve the a-naphtholquinone, ethylenethiourea, and polyethylene glycol weighed in step (1) in 3L of deionized water, and stir for 30 to 70 minutes at a temperature of 40°C to 60°C;

[0025] (3) Add water to the mixed solution obtained in step (2) to dilute it to 37L to prepare an additive for electrolytic copper foil.

[0026] The application of the additive for the electrolytic copper foil is used to prepare the electrolytic copper foil of the negative elect...

Embodiment 2

[0027] Example 2: The additives for electrolytic copper foil, preparation method and application provided in this example, its raw material components and steps are basically the same as those in Example 1, the difference lies in:

[0028] The weight ratio of each raw material component is: a-naphthoquinone 5.0: ethylene thiourea 1.0: polyethylene glycol 2.0;

[0029] The preparation method of the additive for electrolytic copper foil comprises the following steps:

[0030] (1) Take each raw material component by weight ratio as follows: α-naphthoquinone 5.0: ethylenethiourea 1.0: polyethylene glycol 2.0;

[0031] (2) Dissolve the a-naphtholquinone, ethylenethiourea, and polyethylene glycol weighed in step (1) in 3L of deionized water, and stir for 60min at a temperature of 45°C;

[0032] (3) Add water to the mixed solution obtained in step (2) to dilute it to 37L to prepare an additive for electrolytic copper foil.

Embodiment 3

[0033] Example 3: The additives for electrolytic copper foil, preparation method and application provided in this example, its raw material components and steps are basically the same as those in Examples 1 and 2, the difference is that:

[0034] The weight ratio of each raw material component is: α-naphthoquinone 4.0: ethylene thiourea 2.0: polyethylene glycol 3.0;

[0035] The preparation method of the additive for electrolytic copper foil comprises the following steps:

[0036] (1) Take each raw material component by weight ratio as follows: α-naphthoquinone 4.0: ethylenethiourea 2.0: polyethylene glycol 3.0;

[0037] (2) Dissolve the a-naphtholquinone, ethylenethiourea, and polyethylene glycol weighed in step (1) in 3L of deionized water, and stir for 30min at a temperature of 60°C;

[0038] (3) Add water to the mixed solution obtained in step (2) to dilute it to 37L to prepare an additive for electrolytic copper foil.

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Abstract

The invention discloses an additive for electrolytic copper foil, which comprises the following components by the weight ratio: 4.0-6.0 of alpha-naphthoquinone alkyl, 1.0-2.0 of ethylene thiourea and 1.0-3.0 of polyethylene ethanol. The invention further discloses a preparation method and an application of the additive for the electrolytic copper foil. The preparation method is compact in technology, low in cost and short in reaction time; the additive and a proportion of the additive can reduce the roughness of a rough surface of the electrolytic copper foil, increase the crystalizing density of a crystal grain, and improve the tensile strength and the anti-stripping strength; and the additive is reasonably added, so that the quality of the prepared copper foil can achieve that the roughness Rz of the rough surface is less than 2 micrometers, the roughness Ra of a smooth surface is less than 0.35 micrometers, the thickness is 5-7 micrometers, the surface density is 55.5-58.5 g / m<2>, the tensile strength at the normal temperature is greater than 30kg / mm<2>, and the elongation percentage at the normal temperature is greater than 2%.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper manufacturing, in particular to an additive for preparing an electrolytic copper foil of a negative electrode collector of a lithium ion battery, a preparation method and an application thereof. Background technique [0002] As an electronic basic material, electrolytic copper foil is mainly used on printed circuit boards (PCBs). However, with the successful development of lithium-ion batteries by Sony in the early 1990s, another use of electrolytic copper foil is lithium-ion negative electrode current collectors. Lithium-ion batteries are mainly used in electronic products such as notebook computers, mobile phones, digital cameras, and MP3 players. [0003] At present, lithium batteries have gradually expanded to the fields of electric bicycles and electric vehicles. The development of new energy vehicles has been mentioned to an unprecedented height by various countries. The thickne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D1/04
Inventor 陈韶明
Owner 安徽华威铜箔科技有限公司
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