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Additive for ultra-thick electrolytic copper foil, preparation method and application

A technology of electrolytic copper foil and additives, which is applied in electrolytic process, electroforming, etc., can solve the problems that cannot meet the needs of high-end circuit boards, and achieve the effects of easy mass production, increased crystal density, and stable product quality

Active Publication Date: 2016-01-06
安徽华威铜箔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current technology can only achieve below 200 microns, which cannot meet the needs of high-end circuit boards.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: The additive for ultra-thick electrolytic copper foil provided in this embodiment is made of polyethylene glycol, silver sulfate and propylene thiourea, and its mass ratio is: the polyethylene glycol 0.8-1.2: sulfuric acid Silver 1.0-1.1: propenylthiourea 0.6-1.3.

[0014] The preparation method of the additive for ultra-thick electrolytic copper foil comprises the following steps:

[0015] (1) by mass ratio is 0.8-1.2: 1.0-1.1: 0.6-1.3, weigh polyethylene glycol, silver sulfate and propenyl thiourea respectively;

[0016] (2) polyethylene glycol, silver sulfate and propenyl thiourea weighed in step (1) are added to 3L deionized water;

[0017] (3) Place the mixed solution obtained in step (2) under the condition of 40-60°C, heat at a constant temperature, and stir for 30-70min to fully dissolve the polyethylene glycol, silver sulfate and propenylthiourea;

[0018] (4) Dilute the solution prepared in step (3) to 37L with water to obtain an additive for u...

Embodiment 2

[0021] Example 2: The additive, preparation method and application of the ultra-thick electrolytic copper foil provided in this example, its components and steps are basically the same as those in Example 1, the difference is that:

[0022] The mass ratio of described polyethylene glycol, silver sulfate, propenyl thiourea is 1: 1: 1;

[0023] A preparation method of the additive for ultra-thick electrolytic copper foil, which comprises the following steps:

[0024] (1) 1: 1: 1 by mass ratio, weigh polyethylene glycol, silver sulfate and propenyl thiourea respectively;

[0025] (2) polyethylene glycol, silver sulfate and propenyl thiourea weighed in step (1) are added to 3L deionized water;

[0026] (3) Place the mixed solution obtained in step (2) under the condition of 45° C., heat at a constant temperature, and stir for 60 minutes to fully dissolve polyethylene glycol, silver sulfate and propylene thiourea;

[0027] (4) Dilute the solution prepared in step (3) to 37L with ...

Embodiment 3

[0029] Example 3: The additives, preparation methods and applications for ultra-thick electrolytic copper foil provided in this example, its components and steps are basically the same as those in Examples 1 and 2, except that:

[0030] The mass ratio of described polyethylene glycol, silver sulfate, propenyl thiourea is 0.8: 1.1: 0.6;

[0031] A preparation method of the additive for ultra-thick electrolytic copper foil, which comprises the following steps:

[0032] (1) By mass ratio of 0.8: 1.1: 0.6, weigh polyethylene glycol, silver sulfate and propenyl thiourea respectively;

[0033] (2) polyethylene glycol, silver sulfate and propenyl thiourea weighed in step (1) are added to 3L deionized water;

[0034] (3) Place the mixed solution obtained in step (2) under the condition of 60° C., heat at a constant temperature, and stir for 30 minutes to fully dissolve polyethylene glycol, silver sulfate and propylene thiourea;

[0035] (4) Dilute the solution prepared in step (3) t...

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Abstract

The invention discloses an additive for an ultra-thick electrolytic copper foil. The additive is prepared by polyethylene glycol, silver sulfate and allyl thiourea, wherein a mass ratio of polyethylene glycol to silver sulfate to allyl thiourea is 0.8-1.2 : 1.0-1.1 : 0.6-1.3. The invention also discloses a preparation method and an application of the additive for the ultra-thick electrolytic copper foil. The additive for the electrolytic copper foil can greatly increase the thickness of a prepared electrolytic copper foil, reduce roughness of a rough surface of the electrolytic copper foil, increase crystalline density of grains and increase tensile strength and anti-peeling strength. The surface roughness of the electrolytic copper foil prepared by the additive is 10-20 [mu]m; the thickness is 150-500 [mu]m; a tensile strength at a room temperature is larger than 30 Kg / mm<2>; and elongation rate at the room temperature is higher than 20%.

Description

technical field [0001] The invention relates to the field of electrolytic copper foil manufacturing, in particular to an additive for preparing ultra-thick electrolytic copper foil for high-end circuit boards, a preparation method and application thereof. Background technique [0002] As an electronic basic material, electrolytic copper foil is mainly used on printed circuit boards (PCBs). Additives have a great influence on the appearance and structure of electrolytic copper foil. The additives currently used in the production of electrolytic copper foil are: 1. Inorganic additives, such as inorganic additives containing arsenic and antimony, are used to increase cathode polarization and inhibit abnormal growth of metals to improve the elasticity, strength, hardness and smoothness of copper foil ; 2. Organic additives, such as hydrolyzed animal protein powder (gelatin) and PEG, are used to improve the shape of the peaks and valleys on the rough surface of copper foil. The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D3/38
Inventor 陈韶明
Owner 安徽华威铜箔科技有限公司
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