Electrolytic copper foil with low-contour and high property and producing method thereof
An electrolytic copper foil, high-performance technology, applied in the electrolytic process, electroforming, printed circuit components, etc., can solve the problems of bottom corrosion, low roughness, etc., to reduce rough surface roughness, increase crystal density, extend rate-enhancing effect
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Embodiment 1
[0014] Embodiment 1 of the present invention: The present invention adopts a direct current electrodeposition process, which is realized by reasonably matching the composition of the electrolyte with the electrodeposition process parameters, and adding organic mixed additives during the electrolysis process. The process is as follows:
[0015] Using electrolyte, the copper concentration is 70~80g / L, H 2 SO 4 The concentration is 100~110g / L, Cl - The parameters of 40±10ppm are matched, T50~55℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 35m 3 / h, the current density is 8500A / m 2 Conduct electrodeposition.
[0016] The composition of the organic mixed additive is: SP (sodium polydithiodipropane sulfonate) 100-200mg / L, polyethylene glycol 20-30ml / L, gelatin 1-3g / L, cellulose 1-5g / L, Triisopropanolamine 3~4ml / L.
[0017] The low-profile high-performance electrolytic copper foil prepared by the examples has the surface grains of the matte ...
Embodiment 2
[0018] Embodiment 2 of the present invention: the copper concentration of the electrolyte is 85~95g / L, H 2 SO 4 The concentration is 90~100g / L, Cl - The parameters of 40±10ppm are matched, T55~60℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 40m 3 / h, the current density is 9000A / m 2 Conduct electrodeposition.
[0019] The composition of the organic mixed additive is: SP (sodium polydithiodipropane sulfonate) 350-500mg / L, polyethylene glycol 35-50ml / L, gelatin 2-3g / L, cellulose 2-3g / L, Triisopropanolamine 4~5ml / L.
[0020] The prepared low-profile high-performance electrolytic copper foil has an equiaxed pyramidal surface grain, and the roughness of the matte surface is RZ≤2.37μm, the thickness is 18μm, the peeling strength of the matte foil is ≥0.48kg / cm, and the tensile strength ≥338MPa, elongation ≥6.3%.
Embodiment 3
[0021] Embodiment 3 of the present invention: the copper concentration of the electrolyte is 100~120g / L, H 2 SO 4 The concentration is 60~80g / L, Cl - The parameters of 40±10ppm are matched, T58~60℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 50m 3 / h, the current density is 10000A / m 2 Conduct electrodeposition.
[0022] The composition of the organic mixed additive is: SP (sodium polydithiodipropane sulfonate) 500-750mg / L, polyethylene glycol 50-75ml / L, gelatin 2-3g / L, cellulose 2-3g / L, Triisopropanolamine 5~8ml / L.
[0023] The prepared low-profile high-performance electrolytic copper foil has an equiaxed pyramidal surface grain, and the roughness of the matte surface is RZ≤2.15μm, the thickness is 18μm, the peeling strength of the matte foil is ≥0.65kg / cm, and the tensile strength ≥353MPa, elongation ≥7%.
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