Electrolytic copper foil with low-contour and high property and producing method thereof

An electrolytic copper foil, high-performance technology, applied in the electrolytic process, electroforming, printed circuit components, etc., can solve the problems of bottom corrosion, low roughness, etc., to reduce rough surface roughness, increase crystal density, extend rate-enhancing effect

Active Publication Date: 2009-09-23
湖北中科铜箔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a low-profile high-performance electrolytic copper foil and its preparation method, through reasonable configuration of electrolyte composition and electrodeposition process parameters, and adding reasonable organic additives, to solve the current problem of more than 8500A per square meter The roughness problem of large-scale production, in order to realize the preparation of low-profile electrolytic copper foil with low roughness and stable performance, completely solve the quality problems such as "bottom corrosion" caused by the production of fine lines

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1 of the present invention: The present invention adopts a direct current electrodeposition process, which is realized by reasonably matching the composition of the electrolyte with the electrodeposition process parameters, and adding organic mixed additives during the electrolysis process. The process is as follows:

[0015] Using electrolyte, the copper concentration is 70~80g / L, H 2 SO 4 The concentration is 100~110g / L, Cl - The parameters of 40±10ppm are matched, T50~55℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 35m 3 / h, the current density is 8500A / m 2 Conduct electrodeposition.

[0016] The composition of the organic mixed additive is: SP (sodium polydithiodipropane sulfonate) 100-200mg / L, polyethylene glycol 20-30ml / L, gelatin 1-3g / L, cellulose 1-5g / L, Triisopropanolamine 3~4ml / L.

[0017] The low-profile high-performance electrolytic copper foil prepared by the examples has the surface grains of the matte ...

Embodiment 2

[0018] Embodiment 2 of the present invention: the copper concentration of the electrolyte is 85~95g / L, H 2 SO 4 The concentration is 90~100g / L, Cl - The parameters of 40±10ppm are matched, T55~60℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 40m 3 / h, the current density is 9000A / m 2 Conduct electrodeposition.

[0019] The composition of the organic mixed additive is: SP (sodium polydithiodipropane sulfonate) 350-500mg / L, polyethylene glycol 35-50ml / L, gelatin 2-3g / L, cellulose 2-3g / L, Triisopropanolamine 4~5ml / L.

[0020] The prepared low-profile high-performance electrolytic copper foil has an equiaxed pyramidal surface grain, and the roughness of the matte surface is RZ≤2.37μm, the thickness is 18μm, the peeling strength of the matte foil is ≥0.48kg / cm, and the tensile strength ≥338MPa, elongation ≥6.3%.

Embodiment 3

[0021] Embodiment 3 of the present invention: the copper concentration of the electrolyte is 100~120g / L, H 2 SO 4 The concentration is 60~80g / L, Cl - The parameters of 40±10ppm are matched, T58~60℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 50m 3 / h, the current density is 10000A / m 2 Conduct electrodeposition.

[0022] The composition of the organic mixed additive is: SP (sodium polydithiodipropane sulfonate) 500-750mg / L, polyethylene glycol 50-75ml / L, gelatin 2-3g / L, cellulose 2-3g / L, Triisopropanolamine 5~8ml / L.

[0023] The prepared low-profile high-performance electrolytic copper foil has an equiaxed pyramidal surface grain, and the roughness of the matte surface is RZ≤2.15μm, the thickness is 18μm, the peeling strength of the matte foil is ≥0.65kg / cm, and the tensile strength ≥353MPa, elongation ≥7%.

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Abstract

The invention discloses a low-profile high-performance electrolytic copper foil. The crystal grains on the matte surface are in the shape of an equiaxed pyramid, and the roughness RZ of the matte surface is ≤ 2.5 μm, the thickness is 18 μm, and the anti-peeling strength of the matte foil is ≥ 0.45kg / cm , Tensile strength ≥ 330MPa, elongation ≥ 6%. The invention also discloses a preparation method of the electrolytic copper foil, which is realized by adopting a direct current electrodeposition process, rationally matching the composition of the electrolyte with the parameters of the electrodeposition process, and adding organic mixed additives during the electrolysis process. Generally, in the large-scale production of current above 8500A per square meter, it is difficult to solve the problem of surface roughness. If the surface roughness is too high, the inner performance of copper foil will be unstable, and the tensile strength, peel strength and elongation will be unsatisfactory. Until it is improved, it cannot meet the requirements for making fine lines. However, the above-mentioned problems are effectively solved through the combination of electrolytes and reasonable configuration of electrodeposition process parameters in the present invention, and through the addition of reasonable additives.

Description

Technical field [0001] The invention relates to an electrolytic copper foil with low profile and high performance, and a preparation method of the electrolytic copper foil, belonging to the technical field of electrolytic copper foil. Background technique [0002] According to different preparation processes, copper foil can be divided into rolled copper foil and electrolytic copper foil. Electrolytic copper foil is the basic raw material of the electronics industry and is mainly used in the multi-layer printed circuit board and polymer lithium battery industry. With the development of 3G products such as electronics, information and communication towards wireless and portability, the high performance of products is also moving towards the goal of "light, thin, short and small". The electrolytic copper foil industry urgently needs to be at the technological level. Upgrading, high-performance electrolytic copper foil technology is still in the "initial stage", so it has broad mark...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04H05K1/09
Inventor 张东石晨张晓鹤胡天庆
Owner 湖北中科铜箔科技有限公司
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