Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of 10Z copper foil hollow FPC

A production method and technology of copper foil, which is applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, and electrical connection formation of printed components, can solve problems such as uneven copper thickness in holes, signal cracking, and via breakage, so as to reduce rough surface Effects of roughness, reliable rejection, uniform thickness

Inactive Publication Date: 2020-05-19
中山市鑫泓电子科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inventor found the following defects when making the above-mentioned multi-layer flexible circuit board: the electroplating via hole may cause via hole breakage and signal cracking due to too thin copper plating or uneven copper thickness in the hole

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of 10Z copper foil hollow FPC
  • Manufacturing method of 10Z copper foil hollow FPC

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] see figure 1 , a 10Z copper foil hollow FPC manufacturing method, comprising the following steps:

[0040] S1. Take the copper foil substrate, pretreat the copper foil substrate, and make via holes and circuit layers;

[0041] The copper foil substrate is a double-sided flexible copper foil substrate, and the pretreatment step of the copper foil substrate includes removing oxides, grease and impurities on the metal surface of the copper foil substrate.

[0042] The specific steps of making the through hole are: opening a via hole on the copper foil base material, attaching a masking film on the entire outer surface of the copper foil base material, the masking film is used to prevent the copper foil base material from being electroplated or etched, and the The masking film is windowed corresponding to the via holes to obtain the substrate to be electroplated, and then the substrate to be electroplated is immersed in the electroplating solution for a preset time to comp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a manufacturing method of a 10Z copper foil hollow FPC, and belongs to the technical field of flexible circuit boards. The manufacturing method comprises the following steps: taking a copper foil base material, preprocessing the copper foil base material, and manufacturing a via hole and a circuit layer; laminating two insulating glue layers on one surface of the copper foil base material layer to obtain a copper foil base material laminated with the insulating glue layers; and forming injection holes in the insulating rubber layers on the copper foil base material laminated with the insulating rubber layers, and injecting a conductive material and the like. The FPC manufacturing method provided by the invention is simple in process; compared with a manufacturing method in the prior art, the method is simpler in process, the production efficiency of the PFC is effectively improved, and the cost is reduced; and the injection holes are formed in the insulating rubber layers, then the conductive materials are poured into the injection holes, the electric connection relation of all the copper foil layers of the multi-layer flexible circuit board is achieved, electroplating conducted after the holes are formed in the copper foil layers is avoided, and therefore, the uniformity of the thickness of the multi-layer flexible circuit board is guaranteed.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, and more specifically, relates to a method for manufacturing a 10Z copper foil hollow FPC. Background technique [0002] FPC is the abbreviation of flexible circuit board. Flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. Flexible circuit board is a technology developed by the United States for the development of space rocket technology in the 1970s. It is a highly reliable and flexible printed circuit board made of polyester film or polyimide as the base material. The circuit board, by embedding the circuit design on the bendable thin plastic sheet, enables a large number of precision components to be stacked in a narrow and limited space, thus forming a bendable flexible cir...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/42H05K1/11
CPCH05K1/118H05K3/429H05K3/4652
Inventor 李硕兵
Owner 中山市鑫泓电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com