Electrolytic copper foil additive for flexible circuit board, preparation method and application thereof

A flexible circuit board, electrolytic copper foil technology, applied in the direction of electrolysis, electroforming, etc., to achieve high tensile strength, uniform thickness, and increase the effect of tensile strength

Active Publication Date: 2016-06-01
安徽华威铜箔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the technical bottleneck of preparing high-performance electrolytic copper foil for flexible circuit boards, especially for ultra-thin copper foils such as copper foils up to 12 μm, lies in the high temperature resistance, surface roughness, and tensile strength of electrolytic copper foils.

Method used

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  • Electrolytic copper foil additive for flexible circuit board, preparation method and application thereof
  • Electrolytic copper foil additive for flexible circuit board, preparation method and application thereof
  • Electrolytic copper foil additive for flexible circuit board, preparation method and application thereof

Examples

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Effect test

Embodiment 1

[0021] Embodiment 1: In the electrolytic copper foil additive for flexible circuit boards provided in this embodiment, in every L of additive solution, it includes the following mass of solute components:

[0022]

[0023] That is, the volume ratio concentration of each solute component in the additive reaches 10-20 ppm of cellulose; 1-3 ppm of titanium sulfate; 3-7 ppm of sodium tungstate; and 5-15 ppm of polypropylene glycol.

[0024] The preparation method of the electrolytic copper foil additive for the flexible circuit board comprises the following steps:

[0025] (1) Weigh each solute component according to the following mass ratio: cellulose 10-20; titanium sulfate 1-3; sodium tungstate 3-7; polypropylene glycol 5-15;

[0026] (2) Dissolve 10-20 cellulose, 1-3 titanium sulfate, 3-7 sodium tungstate, and 5-15 polypropylene glycol weighed in step (1) in warm water at 20 to 60°C, and stir to make each The solute components are fully dissolved, so that the concentration...

Embodiment 2

[0028] Embodiment 2: In the electrolytic copper foil additive for flexible circuit boards provided in this embodiment, in every L of additive solution, it includes the following mass of solute components:

[0029]

[0030] That is, the volume specific concentration of each solute component in the additive reaches 10 ppm of cellulose; 1 ppm of titanium sulfate; 3 ppm of sodium tungstate; and 5 ppm of polypropylene glycol.

[0031] The preparation method of the electrolytic copper foil additive for the flexible circuit board comprises the following steps:

[0032] (1) Weigh each solute component according to the following mass ratio: cellulose 10mg; titanium sulfate 1mg; sodium tungstate 3mg; polypropylene glycol 5mg;

[0033] (2) Dissolve 10mg of cellulose, 1mg of titanium sulfate, 3mg of sodium tungstate, and 5mg of polypropylene glycol weighed in step (1) in water, and stir to fully dissolve each solute component, so that the concentration of the following solutes is: Cel...

Embodiment 3

[0035] Embodiment 3: In the electrolytic copper foil additive for flexible circuit boards provided in this embodiment, in every L of additive solution, it includes the following mass of solute components:

[0036]

[0037] That is, the volume specific concentration of each solute component in the additive reaches 15 ppm of cellulose; 2 ppm of titanium sulfate; 5 ppm of sodium tungstate; and 10 ppm of polypropylene glycol.

[0038] The preparation method of the electrolytic copper foil additive for the flexible circuit board comprises the following steps:

[0039] (1) Weigh each solute component according to the following mass ratio: cellulose 15mg; titanium sulfate 2mg; sodium tungstate 5mg; polypropylene glycol 10mg;

[0040] (2) Dissolve 15mg of cellulose, 2mg of titanium sulfate, 5mg of sodium tungstate, and 10mg of polypropylene glycol weighed in step (1) in water, stir to fully dissolve each solute component, so that the concentration of the following solutes is: Cell...

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Abstract

The invention discloses an electrolytic copper foil additive for a flexible printed circuit board. which is characterized in that every liter of an additive solution comprises the following solute components by mass: 10-20mg of cellulose, 1-3mg of titanous sulfate, 3-7mg of sodium tungstate and 5-15mg of polypropylene glycol. The invention further discloses a preparation method and an application of the additive. By adopting the flexible printed circuit board electrolytic copper foil additive, the roughness of a rough surface of electrolytic copper foil is reduced, the crystal density of crystalline grains is improved, and the tensile strength and the peeling resistance are improved. Due to reasonable addition of the additive, the weight of the prepared copper foil in unit area can be 10<7>g / m<2>, the tensile strength at normal temperature is greater than or equal to 30kg / mm<2>, the peeling resistance can be greater than or equal to 0.8kg / cm, the elongation at normal temperature can be greater than or equal to 25%, the surface roughness Ra is less than or equal to 2.0mm, and the standard buckling is greater than 150000 times, so that the additive is far better than the conventional additive.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper manufacturing, in particular to an additive for preparing electrolytic copper foil of a flexible circuit board, a preparation method and an application thereof. Background technique [0002] As an electronic basic material, electrolytic copper foil is mainly used on printed circuit boards (PCBs), especially flexible circuit boards. In recent years, breakthroughs have been made in the technical research on the application of domestic electrolytic copper foil in place of imported copper foil on circuit boards. Additives have a great influence on the morphology and structure of the copper foil of the flexible circuit board. [0003] At present, the technical bottleneck of preparing high-performance electrolytic copper foil for flexible circuit boards, especially for ultra-thin copper foils such as copper foils up to 12 μm, lies in the high temperature resistance, surface roughness, and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D3/38
Inventor 陈韶明
Owner 安徽华威铜箔科技有限公司
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