The application provides a combined additive for ultra-thin
copper foil and a process for manufacturing ultra-thin
copper foil, and belongs to the technical field of preparing electrolytic
copper foil. The combined additive comprises A agent, B agent, C agent, D agent, E agent and F agent. The A agent is collagen, the concentration of which in
electrolyte is 3-5 g / L. The B agent is mercaptoimidazole
sodium propyl
sulfonate, the concentration of which in
electrolyte is 1-3 g / L. The C agent is dimethylamide
sodium propane sulfonate, the concentration of which in
electrolyte is 1-3 g / L. The D agent is phenyl disulfide
sodium propane sulfonate, the concentration of which in electrolyte is 0.5-1 g / L. The E agent is
ethylene thiourea, the concentration of which in electrolyte is 0.2-0.5 g / L. The F agent is low-molecular
protein, the concentration of which in electrolyte is 2-3.5 g / L. Through the application, suitable additives are selected, and the combined additive is formed by screening the amount of components, so that the
crystal grain structure of the manufactured ultra-thin
copper foil is uniform and small, so as to improve the tensile strength, elongation, gloss and other properties.