9 results about "Ethylene thiourea" patented technology

The invention discloses a preparation method of a 3-micron ultrathin lithium battery copper foil. The preparation method comprises the following steps: preparing a copper sulfate electrolyte; a wetting agent, a brightening agent and a high resistance agent are added into the copper sulfate electrolyte, the high resistance agent is at least one of thiazolidinethione, polyethyleneimine, 2-mercaptobenzimidazole and ethylene thiourea, and a mixed additive is formed; polishing and grinding a cathode roller by adopting a flying wing wheel, and carrying out electrolytic treatment on the mixed additive through the polished and ground cathode roller to obtain a first-stage copper foil; and the first-stage copper foil is placed in a nitrogen furnace to be subjected to annealing treatment, and the 3-micron ultrathin lithium battery copper foil is obtained. The invention aims to solve the technical problems that in the prior art, edge tearing, foil breaking, warping, dark appearance oxidation and the like are prone to occurring in the production process of the ultrathin copper foil, the tensile strength and the ductility are difficult to consider at the same time, and stable mass production of the 3-micron copper foil is still difficult.

The invention relates to the technical field of electrolytic copper foil production, in particular to an electrolyte for preparing a low-profile and high-tensile-strength dual-gloss copper foil and a preparation method and application of the electrolyte. The electrolyte comprises the following components: 2 to 15 mg / L of lanthanum chloride, 5 to 25 mg / L of sodium dithiodipropane sulfonate, 8 to 20 g / L of ethylene thiourea, 15 to 40 mg / L of chloride ions, 80 to 120 g / L of sulfuric acid and 70 to 100 g / L of copper ions. Compared with the traditional double-light copper foil, the double-light copper foil disclosed by the invention has the advantages of lower surface profile (namely low surface area ratio), higher tensile strength and ductility and improved mechanical properties by utilizing interaction or cooperation among additives such as lanthanum chloride, ethylene thiourea, SPS and chloride ions.

The invention provides a composition for forming vulcanized rubber, the vulcanized rubber as well as a preparation method and application of the vulcanized rubber. The composition for forming vulcanized rubber comprises the following components in parts by weight: 100 parts of matrix rubber, 50-70 parts of filler, 1-3 parts of bonding resin, 2.7-7.5 parts of a bonding agent, 1.5-5 parts of an anti-aging agent, 5-13 parts of zinc oxide and 2.5-10 parts of a vulcanizing agent, wherein the matrix rubber comprises natural rubber and epichlorohydrin rubber; the vulcanizing agent comprises ethylene thiourea. Through the synergistic effect of the epichlorohydrin rubber, the ethylene thiourea and the zinc oxide, the modulus and the aging resistance of the prepared vulcanized rubber can be remarkably improved, the bonding strength of the rubber and a tire carcass steel wire is enhanced, and the high bonding strength can be maintained even under the harsh thermo-oxidative aging and damp-heat aging conditions.

The presently claimed invention relates to dielectric polishing composition comprising (A) surface - modified colloidal silica particles comprising a negatively - charged group on the surface of the particles, wherein the surface-modified colloidal silica particles have a negative charge, a particle size of from 5 nm to 200 nm, and a zeta potential < -35 mV at a pH in the range of from ≥ 2.0 to ≤ 4.5; (B) at least one buffering agent selected from L-arginine, lysine, or histidine; (C) at least one iron (III) oxidizer; (D) at least one pH adjusting agent selected from 2-amino-2-methyl- propan-1-ol or phosphoric acid and salts thereof; (E) at least one stabilizer; (F) at least one corrosion inhibitor selected from formamidine sulfinic acid, L- cysteine, ethylene thiourea, thiourea, N-(4-pyridyl)thiourea), N-(n-propyl)thiourea, cysteine sulfinic acid, 4-aminobenzene-1- sulfinic acid, N-(2-mercaptopropionyl)glycine, 2-oxooxane-4-sulfonic acid, L-cysteic acid, 2- amino-thiobiuret, L-methionine, or homocysteine; and (G) an aqueous medium, wherein the pH of the composition is in the range of from ≥ 2.0 to ≤ 5.0.

The application provides a combined additive for ultra-thin copper foil and a process for manufacturing ultra-thin copper foil, and belongs to the technical field of preparing electrolytic copper foil. The combined additive comprises A agent, B agent, C agent, D agent, E agent and F agent. The A agent is collagen, the concentration of which in electrolyte is 3-5 g / L. The B agent is mercaptoimidazole sodium propyl sulfonate, the concentration of which in electrolyte is 1-3 g / L. The C agent is dimethylamide sodium propane sulfonate, the concentration of which in electrolyte is 1-3 g / L. The D agent is phenyl disulfide sodium propane sulfonate, the concentration of which in electrolyte is 0.5-1 g / L. The E agent is ethylene thiourea, the concentration of which in electrolyte is 0.2-0.5 g / L. The F agent is low-molecular protein, the concentration of which in electrolyte is 2-3.5 g / L. Through the application, suitable additives are selected, and the combined additive is formed by screening the amount of components, so that the crystal grain structure of the manufactured ultra-thin copper foil is uniform and small, so as to improve the tensile strength, elongation, gloss and other properties.

The invention relates to agriculture, and more particularly to plant cultivation, and concerns a fungicidal and bactericidal preparation based on copper and thiourea or derivatives thereof, as well as the use of said preparation in the cultivation of spring-sown and autumn-sown cereals and leguminous plants, field vegetable crops and protected vegetable crops, tree and shrub crops, fruit crops, berry crops, aromatic crops, horticultural crops, ornamental crops, cucurbitaceous crops, tilled crops, industrial crops and feed crops. The claimed fungicidal or bactericidal preparation contains a complex compound of copper (I) with thiourea or methylthiourea, or N,N'-dimethylthiourea, or ethylthiourea, or N,N'-diethylthiourea, or ethylene thiourea, or N,N'-bis(dimethylaminomethyl)thiourea and a complex compound of silver with thiourea or methylthiourea, or N,N'-dimethylthiourea, or ethylthiourea, or N,N'-diethylthiourea, or ethylene thiourea, or N,N'-bis(dimethylaminomethyl)thiourea. The claimed fungicidal or bactericidal preparation includes a mixed complex compound of copper (I) and silver with thiourea or methylthiourea, or N,N'-dimethylthiourea, or ethylthiourea, or N,N'-diethylthiourea, or ethylene thiourea, or N,N'-bis(dimethylaminomethyl)thiourea.

The purpose of the present invention is to provide: a rubber composition having excellent wear resistance and adhesion between the obtained vulcanized rubber and a reinforcing layer having a metal surface; and a laminate provided with a reinforcing layer having a metal surface and a rubber layer made of vulcanized rubber as the rubber composition. The present invention relates to a rubber composition comprising 100 parts by mass of a rubber component comprising chloroprene rubber, a rubber composition containing 5-14 parts by mass (inclusive) of silica, 1.0 part by mass or less of sulfur, and ethylene thiourea; and a laminate and a hose provided with a reinforcement layer having a metal surface and a rubber layer made of vulcanized rubber as the rubber composition.

The invention discloses an additive of a 1-micron electrolytic copper foil and a preparation method of the 1-micron electrolytic copper foil. The additive is prepared from the following components: 10mg / L to 85mg / L of polyethylene glycol 6000 #, 0.5 mg / L to 9mg / L of hydroxyethyl cellulose, 3mg / L to 26mg / L of fatty alcohol-polyoxyethylene ether sulfonated succinic acid monoester disodium, 20mg / L to 185mg / L of sodium hydroxymethyl sulfonate, 15mg / L to 80mg / L of sodium dithiodipropane sulfonate, 2mg / L to 27mg / L of thiazolidinethione, 0.3 mg / L to 9.5 mg / L of 2-mercaptobenzimidazole and 0.3 mg / L to 9.5 mg / L of ethylene thiourea. The method has the beneficial effects that by optimizing an additive process, the strength of the 1-micron copper foil is improved, the internal stress of the 1-micron copper foil is reduced, the compactness and the uniformity of the 1-micron copper foil are improved, and the 1-micron copper foil can be completely stripped from the surface of a cathode; by optimizing the cathode polishing and grinding process, the surface roughness of the titanium cathode plate is reduced, and pinholes and surface defects of 1-micron copper foil are reduced; by providing the foil uncovering process for the ultrathin copper foil, the copper foil of 1 micron can be completely stripped from the surface of a cathode.

The invention provides a high-tensile copper foil electrolyte additive composition, a copper electrolyte and a preparation method of an electrolytic copper foil, and belongs to the technical field of electrolytic copper foils. The high-tensile copper foil electrolyte additive composition provided by the invention comprises the sulfur-containing compound and ethylene thiourea, and a complex formed by copper ions and ethylene thiourea can provide a binding site for a sulfur-containing organic matter, so that the mechanical property of an electrolytic copper foil can be improved. By means of polyethylene glycol and chlorine salt, original uneven copper plating distribution becomes uniform, and the flattening capacity of the electrolytic copper foil is improved; a nitrogen-containing compound is used for improving the flatness of the electrolytic copper foil and improving the tensile strength of the electrolytic copper foil; the hydroxyethyl cellulose is added, so that the roughness of the electrolytic copper foil is reduced, the compactness is improved, the generation of holes is reduced, and the tensile strength of the electrolytic copper foil is further improved.