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5 results about "Ethylene thiourea" patented technology

Ethylene thiourea (ETU) is an organosulfur compound with the formula C3H6N2S. It is an example of an N,N-disubstituted thiourea. It is a white solid. It is synthesized by treating ethylenediamine with carbon disulfide.

Preparation method of 3-micron ultrathin lithium battery copper foil

The invention discloses a preparation method of a 3-micron ultrathin lithium battery copper foil. The preparation method comprises the following steps: preparing a copper sulfate electrolyte; a wetting agent, a brightening agent and a high resistance agent are added into the copper sulfate electrolyte, the high resistance agent is at least one of thiazolidinethione, polyethyleneimine, 2-mercaptobenzimidazole and ethylene thiourea, and a mixed additive is formed; polishing and grinding a cathode roller by adopting a flying wing wheel, and carrying out electrolytic treatment on the mixed additive through the polished and ground cathode roller to obtain a first-stage copper foil; and the first-stage copper foil is placed in a nitrogen furnace to be subjected to annealing treatment, and the 3-micron ultrathin lithium battery copper foil is obtained. The invention aims to solve the technical problems that in the prior art, edge tearing, foil breaking, warping, dark appearance oxidation and the like are prone to occurring in the production process of the ultrathin copper foil, the tensile strength and the ductility are difficult to consider at the same time, and stable mass production of the 3-micron copper foil is still difficult.
Owner:JIANGXI HUAXIN MATERIALS CO LTD

Electrolyte for preparing low-profile and high-tensile-strength dual-gloss copper foil and preparation method and application thereof

The invention relates to the technical field of electrolytic copper foil production, in particular to an electrolyte for preparing a low-profile and high-tensile-strength dual-gloss copper foil and a preparation method and application of the electrolyte. The electrolyte comprises the following components: 2 to 15 mg / L of lanthanum chloride, 5 to 25 mg / L of sodium dithiodipropane sulfonate, 8 to 20 g / L of ethylene thiourea, 15 to 40 mg / L of chloride ions, 80 to 120 g / L of sulfuric acid and 70 to 100 g / L of copper ions. Compared with the traditional double-light copper foil, the double-light copper foil disclosed by the invention has the advantages of lower surface profile (namely low surface area ratio), higher tensile strength and ductility and improved mechanical properties by utilizing interaction or cooperation among additives such as lanthanum chloride, ethylene thiourea, SPS and chloride ions.
Owner:SHANDONG JINBAO ELECTRONICS

Combined additive for ultra-thin copper foil and process for manufacturing ultra-thin copper foil

The application provides a combined additive for ultra-thin copper foil and a process for manufacturing ultra-thin copper foil, and belongs to the technical field of preparing electrolytic copper foil. The combined additive comprises A agent, B agent, C agent, D agent, E agent and F agent. The A agent is collagen, the concentration of which in electrolyte is 3-5 g / L. The B agent is mercaptoimidazole sodium propyl sulfonate, the concentration of which in electrolyte is 1-3 g / L. The C agent is dimethylamide sodium propane sulfonate, the concentration of which in electrolyte is 1-3 g / L. The D agent is phenyl disulfide sodium propane sulfonate, the concentration of which in electrolyte is 0.5-1 g / L. The E agent is ethylene thiourea, the concentration of which in electrolyte is 0.2-0.5 g / L. The F agent is low-molecular protein, the concentration of which in electrolyte is 2-3.5 g / L. Through the application, suitable additives are selected, and the combined additive is formed by screening the amount of components, so that the crystal grain structure of the manufactured ultra-thin copper foil is uniform and small, so as to improve the tensile strength, elongation, gloss and other properties.
Owner:JIANGXI HANGDIAN COPPER FOIL CO LTD

Additive of 1-micron electrolytic copper foil and preparation method of 1-micron electrolytic copper foil

The invention discloses an additive of a 1-micron electrolytic copper foil and a preparation method of the 1-micron electrolytic copper foil. The additive is prepared from the following components: 10mg / L to 85mg / L of polyethylene glycol 6000 #, 0.5 mg / L to 9mg / L of hydroxyethyl cellulose, 3mg / L to 26mg / L of fatty alcohol-polyoxyethylene ether sulfonated succinic acid monoester disodium, 20mg / L to 185mg / L of sodium hydroxymethyl sulfonate, 15mg / L to 80mg / L of sodium dithiodipropane sulfonate, 2mg / L to 27mg / L of thiazolidinethione, 0.3 mg / L to 9.5 mg / L of 2-mercaptobenzimidazole and 0.3 mg / L to 9.5 mg / L of ethylene thiourea. The method has the beneficial effects that by optimizing an additive process, the strength of the 1-micron copper foil is improved, the internal stress of the 1-micron copper foil is reduced, the compactness and the uniformity of the 1-micron copper foil are improved, and the 1-micron copper foil can be completely stripped from the surface of a cathode; by optimizing the cathode polishing and grinding process, the surface roughness of the titanium cathode plate is reduced, and pinholes and surface defects of 1-micron copper foil are reduced; by providing the foil uncovering process for the ultrathin copper foil, the copper foil of 1 micron can be completely stripped from the surface of a cathode.
Owner:JIANGXI HUAXIN MATERIALS CO LTD