The invention belongs to the technical field of
wire rod machining, and particularly relates to a water drop linear
machining process and device.The water drop linear
machining process comprises the following steps that firstly, a to-be-machined material is placed on a
grinding machine, multiple faces of the material are polished, so that the multiple faces of the material are smooth and free of burrs or impurities, and the polished material is fixed to a
workbench of a linear
cutting machine tool; 2, the material is
cut through a
wire cutting machine, and a water-drop-shaped hole groove is
cut in the material; large surface defects and protrusions on an inner hole are removed in a jet
polishing mode, a smooth initial surface is generated, then the magnetic
abrasive can penetrate into tiny pits in the hole wall, tiny surface defects are further removed, the
surface smoothness is improved, tiny unevenness left after
water jet polishing can be further leveled, and the surface quality is improved. And finally, tiny rough points on the surfaces of the inner holes are uniformly dissolved through electrochemical reaction, so that the mirror surface effect of the surfaces is further improved.