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Composite additive for producing low-profile electrolytic copper foil and sedimentation process of composite additive

A composite additive, electrolytic copper foil technology, applied in the electrolytic process, electroforming and other directions, to achieve the effect of uniform crystal particles, maintaining peel strength, high tensile and elongation performance

Inactive Publication Date: 2017-03-22
建滔(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art, thereby proposing a composite additive for producing low-profile electrolytic copper foil

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0016] This embodiment discloses a composite additive for producing low profile electrolytic copper foil, the components of the additive are as follows:

[0017] The composite additive is composed of: 30ppm sodium 3-mercaptopropanesulfonate, 20ppm ethylenethiourea, 30ppm small molecule gelatin, 50ppm sodium dodecylsulfonate, 50ppm hydroxyethyl cellulose, and the flow rate of the organic mixed additive is 400mL / min.

[0018] A process of the composite additive in the process of depositing copper foil, the process flow is as follows:

[0019] Take the electrolytic solution with copper content of 70g / L, sulfuric acid content of 100g / L, chloride ion of 30ppm, and temperature of 40°C, and then add the composite additive to the electrolytic solution so that the electrolytic solution has a flow rate of 45m 3 / h, current density 5000A / m 2 Electrodeposition was carried out under the parameters.

[0020] Example effect: The 140 micron electrolytic copper foil prepared in this exampl...

Embodiment 2

[0021] Embodiment 2: This embodiment discloses a composite additive for producing low profile electrolytic copper foil, the components of the additive are as follows:

[0022] The composite additive is composed of: 50ppm sodium 3-mercaptopropanesulfonate, 30ppm ethylenethiourea, 30ppm small molecule gelatin, 100ppm sodium dodecylsulfonate, 100ppm hydroxyethyl cellulose, and the flow rate of the organic mixed additive is 500mL / min.

[0023] A process of the composite additive in the process of depositing copper foil, the process flow is as follows:

[0024] The copper content in the electrolyte is 90g / L, the sulfuric acid content is 120g / L, the chloride ion is 30ppm, and the temperature is 50°C. Add organic mixed additives to the electrolyte so that the flow rate of the electrolyte is 60m 3 / h, current density 7500A / m 2 electrodeposition under conditions.

[0025] The effect of the embodiment: the 210 micron electrolytic copper foil prepared in this embodiment has roughness...

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Abstract

The invention belongs to the technical field of electrolytic copper foil and particularly relates to a composite additive for producing low-profile electrolytic copper foil and a sedimentation process of the composite additive. The composite additive comprises four or more compounds of 3-sulfydryl propane sodium sulfonate, ethylene thiourea, small-molecule gelatin, sodium dodecyl sulfonate and hydroxyethyl cellulose. The copper foil made of the additive is high in tensile strength and elongation; grains at the rough-face side of the copper foil are refined; surface roughness is lowered, but certain peeling strength is still maintained; and the composite additive has great market prospect and economic value.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil, and in particular relates to a composite additive for producing low-profile electrolytic copper foil and a deposition process thereof. Background technique [0002] With the rapid development of electronics, communications, aerospace, power grids, automobiles and other industries, high-power PCBs have also developed rapidly. High-power circuit boards in electronics, communication and other equipment are prone to heat due to large currents. Copper foil is the nerve of the circuit board. If the thickness of the copper foil is small and the surface roughness is high, it is easy to cause the line to break due to heat and cause the whole board to be broken. Therefore, the thickness and surface roughness of the copper foil need to be determined requirements. In the production process of copper foil thickness < 70μm, the roughness of the rough surface of copper foil can be controll...

Claims

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Application Information

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IPC IPC(8): C25D1/04
CPCC25D1/04
Inventor 林家宝
Owner 建滔(连州)铜箔有限公司
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