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Mixed additive for electrolytic copper foil, preparation method for mixed additive, and method for preparing ultralow-profile electrolytic copper foil

A technology of mixing additives and electrolytic copper foil, which is applied in electrolytic process, electroforming, etc., can solve the problems of no major breakthrough in technology, and achieve the effect of easy control and improved bending resistance

Inactive Publication Date: 2012-03-21
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] At present, the domestic VLP electrolytic copper foil is mainly double-sided copper foil for lithium-ion batteries, and there is no major breakthrough in the technology of VLP electrolytic copper foil for FPC.

Method used

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  • Mixed additive for electrolytic copper foil, preparation method for mixed additive, and method for preparing ultralow-profile electrolytic copper foil
  • Mixed additive for electrolytic copper foil, preparation method for mixed additive, and method for preparing ultralow-profile electrolytic copper foil
  • Mixed additive for electrolytic copper foil, preparation method for mixed additive, and method for preparing ultralow-profile electrolytic copper foil

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Effect test

Embodiment 1

[0030] Mixed additives for electrolytic copper foil, the raw materials contained in the aqueous solution of mixed additives per liter are: 1.0g gum arabic, 1.5g hydroxyethyl cellulose, 0.8g gelatin, 0.8g sodium dimercaptodipropane sulfonate, 0.02 ethylene thiourea g.

Embodiment 2

[0032] Mixed additives for electrolytic copper foil, the raw materials contained in the aqueous solution of mixed additives per liter are: 0.5g of gum arabic, 2.5g of hydroxyethyl cellulose, 1.2g of gelatin, 1.2g of sodium dimercaptodipropanesulfonate, 0.05g of ethylene thiourea g.

Embodiment 3

[0034] Mixed additives for electrolytic copper foil, the raw materials contained in the aqueous solution of mixed additives per liter are: 1.6g of gum arabic, 2.0g of hydroxyethyl cellulose, 1.0g of gelatin, 1.0g of sodium dimercaptodipropane sulfonate, 0.03 ethylene thiourea g.

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Abstract

The invention provides a mixed additive for an ultralow-profile (VLP) electrolytic copper foil. The invention is characterized in that: each liter of mixed additive comprises 0.3 to 2g of Arabic gum (AG), 1 to 2.5g of hydroxyethylcellulose (HEC), 0.5 to 1.6g of gelatin (Glue), 0.5 to 1.5g of sodium dithiodipropane sulfonate (SPS) and 0.01 to 0.1g of ethylene thiourea (N). In the 12-micron VLP copper foil produced by the mixed additive, the tensile strength at normal temperature (23 DEG C) is more than 380 MPa; the elongation percentage at normal temperature is more than 6 percent; the tensile strength at high temperature (180 DEG C) is more than 200 MPa; and the elongation percentage at high temperature is more than 8 percent. The roughness Rz of the crystal growth surface (M surface) is 1.5 to 2.5 mu m. The mixed additive is particularly applicable to a flexible printed circuit board (FPC) and a lithium ion battery.

Description

technical field [0001] The invention relates to a mixed additive for ultra-low profile electrolytic copper foil and a preparation method thereof, belonging to the technical field of high-precision electrolytic copper foil production technology. Background technique [0002] Flexible Printed Circuit (FPC), referred to as soft board, has the advantages of softness, lightness, thinness and flexibility. It has been widely used in information electronics products under the trend of lightness, thinness, shortness and smallness. Notebook computers, digital cameras, mobile phones, video cameras, LCD monitors and other products. my country is the second largest exporter of printed circuit boards after Japan. As the integration of printed circuit boards increases, electronic circuits tend to be high-precision and high-density, and the frequency of signal transmission is getting higher and higher. This requires the use of High-quality copper foil must have excellent etching proper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C25D3/38
Inventor 杨祥魁刘建广马学武宋召霞徐策王祝明温卫国
Owner SHANDONG JINBAO ELECTRONICS
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