Hanger for electroplating bridge rectifier frame

Abstract

The invention discloses a hanger for electroplating a bridge rectifier frame. The hanger comprises a plurality of support rods which are vertically arranged side by side, wherein a plurality of brackets which radially extend outwards are arranged at two opposite sides of each support rod up and down side by side; a conductive plating part shelving section which is tipsily bent into a U shape downwards is arranged at the middle part of each bracket; a baffle rod is transversely connected between the tail ends of the brackets on two adjacent support rods. The hanger has the beneficial effects that the hanger is directly placed without a hook; the point discharge phenomenon is avoided; the hanger is high in electroplating effect, high in stability, and high in operating efficiency, and does not cause bending deformation of a plating part.

Description

technical field [0001] The invention relates to a hanger for rectifier bridge stack frame electroplating. Background technique [0002] At present, the hangers used in the electroplating of rectifier bridge stack frames are generally in the form of hooks. The frame is hung on the hooks during electroplating, but the hooks are easy to deform. When the thickness of the coating on the hooks is too thick, during the electroplating process, often produce The tip discharge phenomenon forms a dendritic coating crystal, and at the same time, the hook mark left on the product will become larger and larger. The dendrites produced on the conductive joint will fall into the plating solution and disperse, which will cause problems such as rough coating and burrs on the workpiece, and , the plating layer on the conductive joint is getting thicker and thicker, and the small hole on the workpiece may not be able to insert the conductive joint. The operation efficiency is slow, the producti...

AI Technical Summary

Problems solved by technology

[0002] At present, the hangers used in the electroplating of rectifier bridge stack frames are generally in the form of hooks. The frame is hung on the hooks during electroplating, but the hooks are easy to deform. When the thickness of the coating on the hooks is too thick, during the electroplating process, often produce The tip discharge phenomenon forms a dendritic coating crystal, and at the same time, the hook mark left on the product will become larger and larger. The dendrites produced on the conductive joint will fall into the plating solution and disperse, which will cause problems such as rough coating and burrs on the workpiece, and , the plating layer on the conductive joint is getting thicker and thicker, and the small hole on the workpiece may not be able to insert the conductive joint

The operation efficiency is slow, the production capacity is low, and improper operation can easily lead to bending and deformation of the workpiece

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