Infrared thermal imager calibration method

Abstract

The invention relates to an infrared thermal imager calibration method. The infrared thermal imager calibration method comprises the following steps that 1 an infrared thermal imager is installed on a calibration working platform and aligned to the center of a standard black body, the infrared thermal imager and the center of the standard black body are made to be arranged coaxially, temperature measuring is conducted multiple times, and a basic error is calculated according to temperature measuring results; 2 the set temperature of the standard black body is adjusted to enable a target image to occupy more than one tenth of a whole view field, a level signal and a noise voltage are measured respectively, and the noise equivalent temperature difference is calculated; 3 an image of the infrared thermal imager is divided into a plurality of regions, the temperature of each region is measured independently and the temperatures are compared so as to detect the temperature uniformity of the regions; 4 the infrared thermal imager is placed at the position of a preset working distance, measuring values of the infrared thermal imager are read continuously at a certain period, and reading continues for a period of time so as to detect the continuous stable working performance of the infrared thermal imager. Compared with the prior art, the infrared thermal imager calibration method is quick in calibration process, and accurate and standard in calibration result.

Description

technical field [0001] The invention relates to a calibration method for an infrared thermal imager. Background technique [0002] Thermal imaging cameras can also be used to detect bad contacts in electrical equipment, as well as overheated components before they can cause catastrophic short circuits and fires. [0003] Statistics show that more than 25% of the common defects in all electrical equipment have the characteristics of heating, which are often caused by poor contact. Thermal imaging products are able to identify thermal hazards at all connection points for all directly visible equipment. For those parts that cannot be directly seen due to shielding, thermal hazards can be found based on the conduction of heat to external components. Thermal imaging products can also easily detect circuit overloads or unbalanced three-phase loads. If infrared thermal imaging technology is not used, poor contact and overheating of equipment can only be found through disassembly...

AI Technical Summary

Problems solved by technology

If infrared thermal imaging technology is not used, poor contact and overheating of equipment can only be found through disassembly inspection and cleaning of joints, which is inefficient

Of course, there is no substitute for thermal imaging products for routine testing of circuit breakers, conductors, busbars and other components

[0004] However, due to the large number of sensitive components involved in the infrared thermal imager, it needs to be checked and verified regularly to ensure that it can work normally. However, there is currently a lack of a convenient, quick and standardized verification method.